Transient two-dimensional thermal analysis of electronic packages by the boundary element method

1999 ◽  
Vol 22 (3) ◽  
pp. 476-486 ◽  
Author(s):  
I. Guven ◽  
Cho Lik Chan ◽  
E. Madenci
AIAA Journal ◽  
1997 ◽  
Vol 35 ◽  
pp. 1080-1081
Author(s):  
Giuseppe Davi ◽  
Rosario M. A. Maretta ◽  
Alberto Milazzo

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