Transient two-dimensional thermal analysis of electronic packages by the boundary element method
1999 ◽
Vol 22
(3)
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pp. 476-486
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2021 ◽
Vol 128
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pp. 195-202
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2017 ◽
Vol 39
(11)
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pp. 4533-4545
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1988 ◽
Vol 26
(12)
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pp. 2739-2753
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2015 ◽
Vol 5
(3)
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pp. 167-176
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1984 ◽
Vol 1
(1)
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pp. 97-106
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