IEEE Transactions on Advanced Packaging
Latest Publications

TOTAL DOCUMENTS

1306
(FIVE YEARS 0)

H-INDEX

62
(FIVE YEARS 0)

Published By Institute Of Electrical And Electronics Engineers

1557-9980, 1521-3323
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Guard Trace Design for Improvement on Transient Waveforms and Eye Diagrams of Serpentine Delay Lines

2010 ◽  
Vol 33 (4) ◽  
pp. 1051-1060 ◽  
Author(s):  
Guang-Hwa Shiue ◽  
Chia-Ying Chao ◽  
Ruey-Beei Wu
Keyword(s):  
Delay Lines

Compromise Impedance Match Design for Pogo Pins With Different Single-Ended and Differential Signal-Ground Patterns

2010 ◽  
Vol 33 (4) ◽  
pp. 953-960 ◽  
Author(s):  
Ruey-Bo Sun ◽  
Ruey-Beei Wu ◽  
Shih-Wei Hsiao ◽  
Daniël De Zutter
Keyword(s):  
Impedance Match ◽  
Differential Signal

A Homogeneous Electrically Conductive Silver Paste

2010 ◽  
Vol 33 (4) ◽  
pp. 899-903 ◽  
Author(s):  
Jianguo Liu ◽  
Yu Cao ◽  
Xiaoye Wang ◽  
Jun Duan ◽  
Xiaoyan Zeng
Keyword(s):  
Electrically Conductive ◽  
Silver Paste

Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation

2010 ◽  
Vol 33 (4) ◽  
pp. 924-937 ◽  
Author(s):  
Mario Miana ◽  
Cristobal Cortes ◽  
Jose Luis Pelegay ◽  
Jose Ramon Valdes ◽  
Thomas Putz
Keyword(s):  
Network Modeling ◽  
Thermal Network ◽  
Multiscale Systems ◽  
Transient Thermal
Load More ...
Sign in / Sign up

Export Citation Format

Share Document