IEEE Transactions on Advanced Packaging
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Published By Institute Of Electrical And Electronics Engineers

1557-9980, 1521-3323
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions

2010 ◽  
Vol 33 (4) ◽  
pp. 804-817 ◽  
Author(s):  
Ki Jin Han ◽  
Madhavan Swaminathan ◽  
Tapobrata Bandyopadhyay
Keyword(s):  
Basis Functions ◽  
Electromagnetic Modeling ◽  
Through Silicon Via

Guard Trace Design for Improvement on Transient Waveforms and Eye Diagrams of Serpentine Delay Lines

2010 ◽  
Vol 33 (4) ◽  
pp. 1051-1060 ◽  
Author(s):  
Guang-Hwa Shiue ◽  
Chia-Ying Chao ◽  
Ruey-Beei Wu
Keyword(s):  
Delay Lines

Table of contents

2010 ◽  
Vol 33 (4) ◽  
pp. 1089-1090

A Homogeneous Electrically Conductive Silver Paste

2010 ◽  
Vol 33 (4) ◽  
pp. 899-903 ◽  
Author(s):  
Jianguo Liu ◽  
Yu Cao ◽  
Xiaoye Wang ◽  
Jun Duan ◽  
Xiaoyan Zeng
Keyword(s):  
Electrically Conductive ◽  
Silver Paste

scholarly journals A Markov Chain Based Hierarchical Algorithm for Fabric-Aware Capacitance Extraction

2010 ◽  
Vol 33 (4) ◽  
pp. 818-827 ◽  
Author(s):  
T El-Moselhy ◽  
I M Elfadel ◽  
L Daniel
Keyword(s):  
Markov Chain ◽  
Capacitance Extraction ◽  
Hierarchical Algorithm

Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation

2010 ◽  
Vol 33 (4) ◽  
pp. 924-937 ◽  
Author(s):  
Mario Miana ◽  
Cristobal Cortes ◽  
Jose Luis Pelegay ◽  
Jose Ramon Valdes ◽  
Thomas Putz
Keyword(s):  
Network Modeling ◽  
Thermal Network ◽  
Multiscale Systems ◽  
Transient Thermal

Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation

2010 ◽  
Vol 33 (4) ◽  
pp. 979-993 ◽  
Author(s):  
Pavan Gunupudi ◽  
Tom Smy ◽  
Jackson Klein ◽  
Z. Jan Jakubczyk
Keyword(s):  
Electronic Circuits ◽  
Nodal Analysis ◽  
Modified Nodal Analysis ◽  
Self Consistent

Compromise Impedance Match Design for Pogo Pins With Different Single-Ended and Differential Signal-Ground Patterns

2010 ◽  
Vol 33 (4) ◽  
pp. 953-960 ◽  
Author(s):  
Ruey-Bo Sun ◽  
Ruey-Beei Wu ◽  
Shih-Wei Hsiao ◽  
Daniël De Zutter
Keyword(s):  
Impedance Match ◽  
Differential Signal
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