Thermal analysis of electronic packaging structure using isogeometric boundary element method

Engineering Analysis with Boundary Elements ◽

10.1016/j.enganabound.2021.04.008 ◽

2021 ◽

Vol 128 ◽

pp. 195-202

Author(s):

Huiping Yu ◽

Yubo Guo ◽

Yanpeng Gong ◽

Fei Qin

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Electronic Packaging ◽

Packaging Structure ◽

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Transient two-dimensional thermal analysis of electronic packages by the boundary element method

IEEE Transactions on Advanced Packaging ◽

10.1109/6040.784502 ◽

1999 ◽

Vol 22 (3) ◽

pp. 476-486 ◽

Author(s):

I. Guven ◽

Cho Lik Chan ◽

E. Madenci

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Electronic Packages ◽

Two Dimensional ◽

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Unsteady Thermal Analysis of Injection Mold by Boundary Element Method.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B ◽

10.1299/kikaib.58.898 ◽

1992 ◽

Vol 58 (547) ◽

pp. 898-903

Author(s):

Satoru YAMAMOTO ◽

Takaaki MATSUOKA ◽

Yoshinori INOUE ◽

Hideroh TAKAHASHI

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Injection Mold ◽

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Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189) ◽

10.1109/stherm.2001.915141 ◽

2002 ◽

Author(s):

Z. Khatir ◽

S. Lefebvre

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Igbt Modules ◽

Power Cycling ◽

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Large-scale thermal analysis of fiber composites using a line-inclusion model by the fast boundary element method

Engineering Analysis with Boundary Elements ◽

10.1016/j.enganabound.2012.11.007 ◽

2013 ◽

Vol 37 (2) ◽

pp. 319-326 ◽

Author(s):

H.T. Wang ◽

Z.H. Yao

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Large Scale ◽

Fiber Composites ◽

Inclusion Model ◽

Line Inclusion ◽

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A HYBRID FINITE ELEMENT — BOUNDARY ELEMENT METHOD (FEM‐BEM) FOR THERMAL ANALYSIS IN ENERGY INSTALLATIONS

COMPEL The International Journal for Computation and Mathematics in Electrical and Electronic Engineering ◽

10.1108/eb010084 ◽

1991 ◽

Vol 10 (2) ◽

pp. 103-114

Author(s):

L. PICHON ◽

A. RAZEK

Keyword(s):

Thermal Analysis ◽

Finite Element ◽

Boundary Element Method ◽

Boundary Element ◽

Hybrid Finite Element ◽

Element Boundary ◽

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A regular indirect boundary element method for thermal analysis

International Journal for Numerical Methods in Engineering ◽

10.1002/nme.1620250214 ◽

1988 ◽

Vol 25 (2) ◽

pp. 495-515 ◽

Author(s):

J. L. Wearing ◽

M. A. Sheikh

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Indirect Boundary Element Method ◽

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Thermal analysis of IGBT by isogeometric boundary element method

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202534 ◽

2020 ◽

Author(s):

Yubo Guo ◽

Huiping Yu ◽

Yanpeng Gong ◽

Fei Qin

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

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Transient thermal analysis of electronic packages by the boundary element method

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606182 ◽

2002 ◽

Author(s):

I. Guven ◽

C.L. Chan ◽

E. Madenci

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Electronic Packages ◽

Transient Thermal Analysis ◽

Transient Thermal ◽

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Thermal analysis of a functionally graded material subject to a thermal gradient using the boundary element method

Composites Engineering ◽

10.1016/0961-9526(95)00030-q ◽

1995 ◽

Vol 5 (7) ◽

pp. 793-806 ◽

Author(s):

Robert K. Goldberg ◽

Dale A. Hopkins

Keyword(s):

Thermal Analysis ◽

Boundary Element Method ◽

Boundary Element ◽

Functionally Graded Material ◽

Thermal Gradient ◽

Functionally Graded ◽

Graded Material ◽

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Thermal analysis of solid-state devices using the boundary element method

IEEE Transactions on Electron Devices ◽

10.1109/16.3380 ◽

1988 ◽

Vol 35 (7) ◽

pp. 1151-1153 ◽

Author(s):

C.C. Lee ◽

A.L. Palisoc ◽

J.M.W. Baynham

Keyword(s):

Thermal Analysis ◽

Solid State ◽

Boundary Element Method ◽

Boundary Element ◽

Solid State Devices ◽

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