1997 Proceedings 47th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

204

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Published By IEEE

078033857x

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Modeling Component Placement Errors In Surface Mount Technology Using Neural Networks

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606290 ◽

2005 ◽

Author(s):

G.S. May ◽

H. Forbes ◽

N. Hussain ◽

A. Louis-Charles

Keyword(s):

Neural Networks ◽

Surface Mount Technology ◽

Surface Mount ◽

Component Placement

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Electronic packaging education: a view from 1992 and 1996 conferences

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606286 ◽

2002 ◽

Cited By ~ 3

Author(s):

J.P. Krusius ◽

Che-Yu Li ◽

J. Fillo

Keyword(s):

Electronic Packaging

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A new premolded packaging technology for low cost E/O device applications

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606126 ◽

2002 ◽

Cited By ~ 1

Author(s):

N. Takehashi ◽

M. Horii

Keyword(s):

Low Cost ◽

Packaging Technology ◽

Device Applications

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Moisture and thermal degradation of cyanate-ester-based die attach material

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606219 ◽

2002 ◽

Cited By ~ 1

Author(s):

J.I.J. Gonzales ◽

M.G. Mena

Keyword(s):

Thermal Degradation ◽

Cyanate Ester ◽

Die Attach

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A computer program that generates an RF electrical model of the parasitics of QFP packages

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606319 ◽

2002 ◽

Cited By ~ 4

Author(s):

M. Caggiano

Keyword(s):

Computer Program ◽

Electrical Model

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Novel solvent bonded low cost pigtailed PIN module

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606131 ◽

2002 ◽

Author(s):

Ching-Long Jiang ◽

S. O'Neill ◽

E. Mak ◽

B. Reysen

Keyword(s):

Low Cost

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Thermal coastline - leadframes for high power at no cost

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606189 ◽

2002 ◽

Author(s):

T. Moore

Keyword(s):

High Power

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High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606199 ◽

2002 ◽

Cited By ~ 8

Author(s):

Y.S. Liu ◽

R.J. Wojnarowski ◽

W.A. Hennessy ◽

J. Rowlette ◽

J. Stack ◽

...

Keyword(s):

Optical Interconnects ◽

High Density ◽

Polymer Waveguides

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A thermally enhanced plastic package with indented leadframe

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606190 ◽

2002 ◽

Author(s):

C.C. Lee ◽

D.H. Chien

Keyword(s):

Plastic Package

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Electronic packaging and reliability education for the 21st century: the University of Maryland CALCE EPRC Program

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606229 ◽

2002 ◽

Author(s):

Y. Joshi ◽

M. Pecht ◽

W. Nakayama

Keyword(s):

21St Century ◽

Electronic Packaging ◽

University Of Maryland ◽

The University

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1997 Proceedings 47th Electronic Components and Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Modeling Component Placement Errors In Surface Mount Technology Using Neural Networks

Electronic packaging education: a view from 1992 and 1996 conferences

A new premolded packaging technology for low cost E/O device applications

Moisture and thermal degradation of cyanate-ester-based die attach material

A computer program that generates an RF electrical model of the parasitics of QFP packages

Novel solvent bonded low cost pigtailed PIN module

Thermal coastline - leadframes for high power at no cost

High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides

A thermally enhanced plastic package with indented leadframe

Electronic packaging and reliability education for the 21st century: the University of Maryland CALCE EPRC Program

1997 Proceedings 47th Electronic Components and Technology Conference
Latest Publications