Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching
1999 ◽
Vol 8
(2)
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pp. 152-160
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Keyword(s):
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2011 ◽
Vol 88
(8)
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pp. 1878-1883
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2011 ◽
Vol 21
(10)
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pp. 105001
2014 ◽
Vol 113
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pp. 35-39
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2018 ◽
Vol 283
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pp. 65-78
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2002 ◽
Vol 11
(3)
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pp. 264-275
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