Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

2014 ◽  
Vol 113 ◽  
pp. 35-39 ◽  
Author(s):  
Jayalakshmi Parasuraman ◽  
Anand Summanwar ◽  
Frédéric Marty ◽  
Philippe Basset ◽  
Dan E. Angelescu ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

Sharp High-Aspect-Ratio AFM Tips Fabricated by a Combination of Deep Reactive Ion Etching and Focused Ion Beam Techniques

2010 ◽  
Vol 10 (1) ◽  
pp. 497-501 ◽  
Author(s):  
David Caballero ◽  
Guillermo Villanueva ◽  
Jose Antonio Plaza ◽  
Christopher A. Mills ◽  
Josep Samitier ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Afm Tips

Antistick Postpassivation of High-Aspect Ratio Silicon Molds Fabricated by Deep-Reactive Ion Etching

2006 ◽  
Vol 15 (1) ◽  
pp. 84-93 ◽  
Author(s):  
J.X. Gao ◽  
L.P. Yeo ◽  
M.B. Chan-Park ◽  
J.M. Miao ◽  
Y.H. Yan ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

SiC Wafer Bonding and Deep Reactive Ion Etching Towards High-Aspect Ratio SiC MEMS Fabrication

2018 ◽  
Vol 86 (5) ◽  
pp. 105-110 ◽  
Author(s):  
Lunet E Luna ◽  
Karl D. Hobart ◽  
Marko J Tadjer ◽  
Rachael L. Myers-Ward ◽  
Travis J. Anderson ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Wafer Bonding ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Mems Fabrication ◽  
Sic Wafer

Fabrication of Micromachined Mold Masters for 3-D, High-Aspect-Ratio Cell Culturing Scaffolds

2005 ◽  
Author(s):  
Yanzhu Zhao ◽  
Xiaosong Wu ◽  
Yong-Kyu Yoon ◽  
Jung-Hwan Park ◽  
Stephen J. Kennedy ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Bone Cell ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Wafer Scale ◽  
Advantages And Disadvantages ◽  
Cell Culturing ◽  
Mold Master

In this paper, three approaches to micromachined mold master structures for molding of a wafer-scale bone culturing platform are compared and contrasted. The processes investigated are a silicon deep-reactive ion etching (DRIE) process, an SU-8/polydimethylsiloxane(PDMS) process, and a multi-step SU-8 process. Upon comparison of the advantages and disadvantages of each approach, a wafer-scale implementation of bone cell culturing substrates is successfully demonstrated using the two-step SU-8 process, and successful duplication of hydrogels based on these molds is demonstrated.

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