Locating Surfaces in 3D Using a Single Pulse-echo Sonar

2020 ◽  
Author(s):  
Fabio Tomas Moreno Ortz ◽  
Antonio Hernandez Zavala
Keyword(s):  
Single Pulse ◽  
Pulse Echo

Origin of the Single Pulse Echo in Co

1973 ◽  
Author(s):  
Mary Beth Stearns ◽  
Hugh C. Wolfe ◽  
C. D. Graham ◽  
J. J. Rhyne
Keyword(s):  
Single Pulse ◽  
Pulse Echo

Transformation of a single-pulse echo into a two-pulse one upon change in excitation pulse form

1992 ◽  
Vol 35 (1) ◽  
pp. 68-69
Author(s):  
G. G. Fedoruk ◽  
V. I. Tsifrinovich ◽  
A. D. Tarasevich
Keyword(s):  
Single Pulse ◽  
Excitation Pulse ◽  
Pulse Form ◽  
Pulse Echo

On mechanisms of single-pulse echo formation in multidomain magnetic materials

2001 ◽  
Vol 291 (1) ◽  
pp. 34-38 ◽  
Author(s):  
A.M Akhalkatsi ◽  
G.I Mamniashvili ◽  
S Ben-Ezra
Keyword(s):  
Magnetic Materials ◽  
Single Pulse ◽  
Pulse Echo

scholarly journals Cumulative Single-Pulse NMR Echoes in Cobalt

2015 ◽  
Vol 7 (6) ◽  
pp. 26 ◽  
Author(s):  
Grigor I. Mamniashvili ◽  
Tatiana O. Gegechkori ◽  
Zurab G. Shermadini
Keyword(s):  
Radio Frequency ◽  
Pulse Sequence ◽  
Single Pulse ◽  
Threshold Value ◽  
Pulse Power ◽  
Radio Frequency Pulse ◽  
Rf Pulse ◽  
Pulse Echo ◽  
Echo Effect ◽  
Frequency Pulse

<p class="1Body">In this work the cumulative single-pulse echo effect in cobalt was studied when a train of single-pulse echoes generated by a repeating single RF pulse sequence, exhibits growth rather than damping. The phenomenon is observed below some threshold value of radio-frequency pulse power when the nonresonant mechanism of single-pulse echo excitation in cobalt becomes effective.<strong></strong></p>

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

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