Millimeter-Wave 3D Integration Techniques using LTCC and Related Multilayer Circuits

Mapping Intimacies ◽

10.1109/euma.2000.338762 ◽

2000 ◽

Author(s):

Wolfgang Menzel ◽

Jurgen Kassner

Keyword(s):

Millimeter Wave ◽

3D Integration ◽

Integration Techniques

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Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

2011 IEEE MTT-S International Microwave Symposium ◽

10.1109/mwsym.2011.5972815 ◽

2011 ◽

Author(s):

Amin Enayati ◽

Steven Brebels ◽

Guy A. E. Vandenbosch ◽

Walter Deraedt ◽

Antti V. Raisanen

Keyword(s):

Thin Film ◽

Millimeter Wave ◽

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Silicon interposer: A versatile platform towards full-3D integration of wireless systems at millimeter-wave frequencies

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159713 ◽

2015 ◽

Author(s):

Ossama El Bouayadi ◽

Laurent Dussopt ◽

Yann Lamy ◽

Cedric Dehos ◽

Christine Ferrandon ◽

...

Keyword(s):

Millimeter Wave ◽

Wireless Systems ◽

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Advanced Integration Techniques on Broadband Millimeter-Wave Beam Steering for 5G Wireless Networks and Beyond

IEEE Journal of Quantum Electronics ◽

10.1109/jqe.2015.2509256 ◽

2016 ◽

Vol 52 (1) ◽

pp. 1-20 ◽

Author(s):

Zizheng Cao ◽

Qian Ma ◽

Adrianus Bernardus Smolders ◽

Yuqing Jiao ◽

Michael J. Wale ◽

...

Keyword(s):

Wireless Networks ◽

Millimeter Wave ◽

Wave Beam ◽

Beam Steering ◽

Integration Techniques

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3D integration techniques using stacked PCBs and small dipole antenna for wireless sensor nodes

2012 2nd IEEE CPMT Symposium Japan ◽

10.1109/icsj.2012.6523438 ◽

2012 ◽

Author(s):

Shoichi Oshima ◽

Kenichi Matsunaga ◽

Hiroki Morimura ◽

Mitsuru Harada

Keyword(s):

Dipole Antenna ◽

Sensor Nodes ◽

Wireless Sensor ◽

3D Integration ◽

Wireless Sensor Nodes ◽

Small Dipole ◽

Integration Techniques

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3D Integration Techniques Applied to SiGe Power Amplifiers

ECS Transactions ◽

10.1149/1.2986868 ◽

2019 ◽

Vol 16 (10) ◽

pp. 1053-1067 ◽

Author(s):

Ramana M. Malladi ◽

Alvin Joseph ◽

Peter Lindgren ◽

Wan Ni ◽

Dawn Wang ◽

...

Keyword(s):

Power Amplifiers ◽

3D Integration ◽

Integration Techniques

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Research on Transmission Characteristics of Conical-TSV for Millimeter-wave Band in 3D Integration

10.1109/icftic54370.2021.9647126 ◽

2021 ◽

Author(s):

Junhao Wang ◽

Hua Gan ◽

Hongze Zhang ◽

Zhiyuan Zhu

Keyword(s):

Millimeter Wave ◽

Wave Band ◽

Transmission Characteristics ◽

3D Integration ◽

Millimeter Wave Band

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Die-on-wafer and wafer-level 3D integration for millimeter-wave smart antenna tranceivers

The 2005 IEEE Annual Conference Wireless and Micrwave Technology, 2005. ◽

10.1109/wamic.2005.1528358 ◽

2005 ◽

Author(s):

M.M. Hella ◽

S. Devarajan ◽

J.-Q. Lu ◽

K. Rose ◽

R.J. Gutmann

Keyword(s):

Millimeter Wave ◽

Smart Antenna ◽

Wafer Level ◽

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Ultra wideband filtering vertical transition for millimeter wave 3D integration

2015 IEEE International Conference on Communication Problem-Solving (ICCP) ◽

10.1109/iccps.2015.7454204 ◽

2015 ◽

Author(s):

Yang Huang ◽

Mengkui Shen ◽

Zhenhai Shao

Keyword(s):

Millimeter Wave ◽

Ultra Wideband ◽

3D Integration ◽

Vertical Transition

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Sub-millimeter wave InP technologies and integration techniques

2015 IEEE MTT-S International Microwave Symposium ◽

10.1109/mwsym.2015.7167151 ◽

2015 ◽

Author(s):

Vesna Radisic ◽

Kevin M. K. H. Leong ◽

Dennis W. Scott ◽

Cedric Monier ◽

X. B. Mei ◽

...

Keyword(s):

Millimeter Wave ◽

Integration Techniques

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3D Integration Techniques Applied to SiGe Power Amplifiers

ECS Meeting Abstracts ◽

10.1149/ma2008-02/37/2492 ◽

2008 ◽

Keyword(s):

Power Amplifiers ◽

3D Integration ◽

Integration Techniques

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