2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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367
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9781479986095
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers

2015 ◽  
Author(s):  
Vijay Sukumaran ◽  
Thuy Tran-Quinn ◽  
Jorge Lubguban ◽  
Dave Webster ◽  
Brittany Hedrick ◽  
...  

Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

2015 ◽  
Author(s):  
Wei Guo ◽  
Aditya P. Karmarkar ◽  
Xiaopeng Xu ◽  
Geert Van der Plas ◽  
Stefaan Van Huylenbroeck ◽  
...  

Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

2015 ◽  
Author(s):  
Makoto Motoyoshi ◽  
Kohki Yanagimura ◽  
Junichi Takanohashi ◽  
Mariappan Murugesan ◽  
Masahiro Aoyagi ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Integration Technology ◽  
Sensor Application

Solder printability of a stencil with a hydrophobic organic coating

2015 ◽  
Author(s):  
Kyoung-Ho Kim ◽  
Min-Soo Kang ◽  
Ji-Young Jang ◽  
Chang-Joon Lee ◽  
Yong-Won Lee ◽  
...  
Keyword(s):  
Organic Coating

Technology of packaging by Liquid Mold-Underfill (MUF) material for advanced mobile devices

2015 ◽  
Author(s):  
Yuki Ishikawa ◽  
Joji Yukimaru ◽  
Tomoya Takao ◽  
Kazuhiro Ikeda ◽  
Kazuaki Yamane ◽  
...  
Keyword(s):  
Mobile Devices

Low stress bonding for large size die application

2015 ◽  
Author(s):  
Kei Murayama ◽  
Mitsuhiro Aizawa ◽  
Takashi Kurihara
Keyword(s):  
Large Size
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