2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

367

(FIVE YEARS 0)

H-INDEX

13

(FIVE YEARS 0)

Published By IEEE

9781479986095

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Challenge and process optimization of Thermal Compression bonding with Non Conductive Paste

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159635 ◽

2015 ◽

Author(s):

Po-Jen Cheng ◽

W. C. Wu ◽

W. J. Wang ◽

T. M. Pai

Keyword(s):

Process Optimization ◽

Thermal Compression

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Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159813 ◽

2015 ◽

Author(s):

Jian Cai ◽

Junqiang Wang ◽

Qian Wang ◽

Ziyu Liu ◽

Dejun Wang ◽

...

Keyword(s):

Solid State ◽

Low Temperature ◽

Diffusion Bonding ◽

Solid State Diffusion ◽

State Diffusion ◽

Cu Interconnect

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Experimental and numerical investigations on Cu/low-k interconnect reliability during copper pillar shear test

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159809 ◽

2015 ◽

Author(s):

Clement Sart ◽

Sebastien Gallois-Garreignot ◽

Vincent Fiori ◽

Olivier Kermarrec ◽

Caroline Moutin ◽

...

Keyword(s):

Numerical Investigations ◽

Interconnect Reliability ◽

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Impact of uneven solder thickness on IGBT substrate reliability

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159858 ◽

2015 ◽

Author(s):

Hua Lu ◽

Chris Bailey ◽

Liam Mills

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Fundamental investigation of lid interactions with TIM1 and adhesive materials for advanced flip chip packaging

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159873 ◽

2015 ◽

Author(s):

Lyndon Larson ◽

Yin Tang ◽

Adriana Zambova ◽

Cassandra Hale ◽

Sushumna Iruvanti ◽

...

Keyword(s):

Flip Chip ◽

Fundamental Investigation ◽

Flip Chip Packaging ◽

Adhesive Materials

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Study of cracking of thin glass interposers intended for microelectronic packaging substrates

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159866 ◽

2015 ◽

Author(s):

Scott R. McCann ◽

Yoichiro Sato ◽

Venkatesh Sundaram ◽

Rao R. Tummala ◽

Suresh K. Sitaraman

Keyword(s):

Microelectronic Packaging ◽

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Coupling capacitance in face-to-face (F2F) bonded 3D ICs: Trends and implications

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159641 ◽

2015 ◽

Author(s):

Taigon Song ◽

Arthur Nieuwoudt ◽

Yun Seop Yu ◽

Sung Kyu Lim

Keyword(s):

Face To Face ◽

Coupling Capacitance ◽

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Silicon interposer: A versatile platform towards full-3D integration of wireless systems at millimeter-wave frequencies

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159713 ◽

2015 ◽

Author(s):

Ossama El Bouayadi ◽

Laurent Dussopt ◽

Yann Lamy ◽

Cedric Dehos ◽

Christine Ferrandon ◽

...

Keyword(s):

Millimeter Wave ◽

Wireless Systems ◽

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Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159678 ◽

2015 ◽

Author(s):

Hiren D. Thacker ◽

Roshanak Shafiiha ◽

Jon Lexau ◽

Xuezhe Zheng ◽

Stevan S. Djordjevic ◽

...

Keyword(s):

Energy Efficient ◽

Hybrid Integration ◽

Silicon Photonic

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A TSV-less PoP packaging structure for high bandwidth memory

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159698 ◽

2015 ◽

Author(s):

Dyi-Chung Hu ◽

Puru Bruce Lin ◽

Yu-Hua Chen

Keyword(s):

High Bandwidth ◽

Packaging Structure

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