Effect of Assembly Design on a Walking Multi-Arm Robotics for In-Space Assembly

Author(s):  
Katherine McBryan
Keyword(s):  
Author(s):  
Y. D. Mulia

For S-15 and S-14 wells at South S Field, drilling of the 12-1/4” hole section became the longest tangent hole section interval of both wells. There were several challenges identified where hole problems can occur. The hole problems often occur in the unconsolidated sand layers and porous limestone formation sections of the hole during tripping in/out operations. Most of the hole problems are closely related to the design of the Bottom Hole Assembly (BHA). In many instances, hole problems resulted in significant additional drilling time. As an effort to resolve this issue, a new BHA setup was then designed to enhance the BHA drilling performance and eventually eliminate hole problems while drilling. The basic idea of the enhanced BHA is to provide more annulus clearance and limber BHA. The purpose is to reduce the Equivalent Circulating Density (ECD,) less contact area with formation, and reduce packoff risk while drilling through an unconsolidated section of the rocks. Engineering simulations were conducted to ensure that the enhanced BHA were able to deliver a good drilling performance. As a results, improved drilling performance can be seen on S-14 well which applied the enhanced BHA design. The enhanced BHA was able to drill the 12-1/4” tangent hole section to total depth (TD) with certain drilling parameter. Hole problems were no longer an issue during tripping out/in operation. This improvement led to significant rig time and cost savings of intermediate hole section drilling compared to S-15 well. The new enhanced BHA design has become one of the company’s benchmarks for drilling directional wells in South S Field.


Procedia CIRP ◽  
2021 ◽  
Vol 96 ◽  
pp. 121-126
Author(s):  
Anupam Keshari ◽  
Alessandro Simeone ◽  
Manoj Kumar Tiwari

2021 ◽  
pp. 174425912098876
Author(s):  
Maurice Defo ◽  
Michael Lacasse ◽  
Abdelaziz Laouadi

The objective of this work was to compare the hygrothermal responses and the moisture performance of four wood-frame walls as predicted by four hygrothermal (HAM) simulation tools, namely: DELPHIN, WUFI, hygIRC and COMSOL. The four wall systems differ only in their cladding type; these were fibreboard, vinyl, stucco and brick. Three Canadian cities having different climates were selected for simulations: Ottawa, Ontario; Vancouver, British Columbia and Calgary, Alberta. In each city, simulations were run for 2 years. Temperature and relative humidity of the outer layer of OSB sheathing were compared amongst the four simulation tools. The mould growth index on the outer layer of the OSB sheathing was used to compare the moisture performance predicted by the respective hygrothermal simulation tools. Temperature profiles of the outer layer of the OSB sheathing were all in good agreement for the four HAM tools in the three locations. For relative humidity, the highest discrepancies amongst the four tools were found with stucco cladding where differences as high as 20% could be found from time to time. Mould growth indices predicted by the four HAM tools were similar in some cases but different in other cases. The discrepancies amongst the different HAM tools were likely related to: the material property processing, how the quantity of wind-driven rain absorbed at the cladding surface is computed and some implementation details. Despite these discrepancies, The tools generally yielded consistent results and could be used for comparing the impacts of different designs on the risk of premature deterioration, as well as for evaluating the relative effects of climate change on a given wall assembly design.


2021 ◽  
Vol 7 (23) ◽  
pp. eabf9402
Author(s):  
Katherine C. Elbert ◽  
William Zygmunt ◽  
Thi Vo ◽  
Corbin M. Vara ◽  
Daniel J. Rosen ◽  
...  

The use of nanocrystal (NC) building blocks to create metamaterials is a powerful approach to access emergent materials. Given the immense library of materials choices, progress in this area for anisotropic NCs is limited by the lack of co-assembly design principles. Here, we use a rational design approach to guide the co-assembly of two such anisotropic systems. We modulate the removal of geometrical incompatibilities between NCs by tuning the ligand shell, taking advantage of the lock-and-key motifs between emergent shapes of the ligand coating to subvert phase separation. Using a combination of theory, simulation, and experiments, we use our strategy to achieve co-assembly of a binary system of cubes and triangular plates and a secondary system involving two two-dimensional (2D) nanoplates. This theory-guided approach to NC assembly has the potential to direct materials choices for targeted binary co-assembly.


1997 ◽  
Vol 13 (1) ◽  
pp. 21-30 ◽  
Author(s):  
Sim Tian-Soon ◽  
Marcelo H. Ang ◽  
Lim Kah-Bin
Keyword(s):  

2010 ◽  
Vol 10 (8) ◽  
pp. 3531-3536 ◽  
Author(s):  
Virginia M. Cangelosi ◽  
Melanie A. Pitt ◽  
W. Jake Vickaryous ◽  
Corinne A. Allen ◽  
Lev N. Zakharov ◽  
...  

Author(s):  
Hugh I. Connacher ◽  
Sankar Jayaram ◽  
Kevin Lyons

Abstract Virtual reality is a technology which is often regarded as a natural extension to 3D computer graphics with advanced input and output devices. This technology has only recently matured enough to warrant serious engineering applications. The integration of this new technology with software systems for engineering, design and manufacturing will provide a new boost to the field of computer-aided engineering. One aspect of design and manufacturing which may be significantly affected by virtual reality is design for assembly. This paper presents the ideas behind a current research effort aimed at creating a virtual assembly design environment and integrating that environment with a commercial, parametric CAD system.


2018 ◽  
Vol 10 (5) ◽  
pp. 053703 ◽  
Author(s):  
Abhishek Parikh ◽  
Janna Martinek ◽  
Greg Mungas ◽  
Nicholas Kramer ◽  
Guangdong Zhu

Author(s):  
Jiang-tao Ji ◽  
Meng-meng Du ◽  
Xin-wu Du ◽  
Zhi-tao He ◽  
Zhi-hua Zheng ◽  
...  

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