RF characterization of a low cost multichip packaging technology for monolithic microwave and millimeter wave integrated circuits
2009 ◽
Vol 32
(1)
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pp. 84-92
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1995 ◽
Vol 43
(1)
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pp. 63-68
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Keyword(s):
2016 ◽
Vol 39
(2)
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pp. 92-102
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1997 ◽
pp. 223-230
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