Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936754 ◽

2017 ◽

Author(s):

Tung Ching Lui

Keyword(s):

Lead Free ◽

Lifetime Prediction ◽

Lead Free Solder ◽

Solder Material ◽

Download Full-text

Properties of new gold based multicomponent alloys as innovative lead-free solder material

Materials Research Innovations ◽

10.1179/1433075x14y.0000000230 ◽

2014 ◽

Vol 19 (2) ◽

pp. 145-149 ◽

Author(s):

L. Gomidželović ◽

D. Živković ◽

N. Talijan ◽

V. Ćosović

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Multicomponent Alloys ◽

Solder Material ◽

Download Full-text

1217 A study on fatigue strength and notch shape for lead-free solder material

The Proceedings of Conference of Hokuriku-Shinetsu Branch ◽

10.1299/jsmehs.2016.53._1217-1_ ◽

2016 ◽

Vol 2016.53 (0) ◽

pp. _1217-1_-_1217-5_

Author(s):

Tasuku KOSAKA ◽

Yuya FUJINO ◽

Hirokazu ORIYAMA ◽

Takashi KAWAKAMI ◽

Takahiro KINOSHITA

Keyword(s):

Fatigue Strength ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Download Full-text

601 Interaction between Creep and Fatigue Damages for Sn-3.0Ag-0.5Cu Lead Free Solder Material

The Proceedings of Conference of Hokuriku-Shinetsu Branch ◽

10.1299/jsmehs.2014.51._601-1_ ◽

2014 ◽

Vol 2014.51 (0) ◽

pp. _601-1_-_601-2_

Author(s):

Hirokazu Oriyama ◽

Takashi Kawakami ◽

Takahiro Kinoshita

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Download Full-text

Lead free solder material compatibility and technological factors

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. ◽

10.1109/isse.2005.1491007 ◽

2005 ◽

Author(s):

J. Stary ◽

I. Szendiuch

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Technological Factors ◽

Material Compatibility ◽

Download Full-text

Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.43.1868 ◽

2002 ◽

Vol 43 (8) ◽

pp. 1868-1872 ◽

Author(s):

Sabine Knott ◽

Adolf Mikula

Keyword(s):

Thermodynamic Properties ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Free Solder ◽

Download Full-text

Reduction of the Oxide Layer on a Lead-Free Solder Material by Hydrogen Radicals

Transactions of The Japan Institute of Electronics Packaging ◽

10.5104/jiepeng.2.1 ◽

2009 ◽

Vol 2 (1) ◽

pp. 1-4 ◽

Author(s):

S. Kagata ◽

T. Nakashima ◽

A. Izumi

Keyword(s):

Oxide Layer ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Free Solder ◽

Hydrogen Radicals

Download Full-text

Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502779 ◽

2005 ◽

Author(s):

M. Roellig ◽

R. Dudek ◽

S. Wiese ◽

B. Wunderle ◽

K.-J. Wolter ◽

...

Keyword(s):

Lead Free ◽

Lifetime Prediction ◽

Lead Free Solder ◽

Download Full-text

1218 A study on the relationship between strain rate and fatigue life for lead-free solder material

The Proceedings of Conference of Hokuriku-Shinetsu Branch ◽

10.1299/jsmehs.2016.53._1218-1_ ◽

2016 ◽

Vol 2016.53 (0) ◽

pp. _1218-1_-_1218-5_

Author(s):

Yu KITADA ◽

Yuya HUJINO ◽

Hirokazu ORIYAMA ◽

Takashi KAWAKAMI ◽

Takahiro KINOSHITA

Keyword(s):

Fatigue Life ◽

Strain Rate ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Free Solder ◽

The Relationship

Download Full-text

A Study on Damage Mechanism for Lead-Free Solder Material with V Notch

The Proceedings of Mechanical Engineering Congress Japan ◽

10.1299/jsmemecj.2017.j0330201 ◽

2017 ◽

Vol 2017 (0) ◽

pp. J0330201

Author(s):

Tasuku KOUSAKA ◽

Yu KITADA ◽

Takashi KAWAKAMI ◽

Takahiro KINOSHITA

Keyword(s):

Damage Mechanism ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Download Full-text

Fatigue Life of Lead Free Solder Material and Dependency on Strain Rate

The Proceedings of the Materials and Mechanics Conference ◽

10.1299/jsmemm.2016.os02-09 ◽

2016 ◽

Vol 2016 (0) ◽

pp. OS02-09

Author(s):

Yuya FUJINO ◽

Takashi KAWAKAMI ◽

Takahiro KINOSHITA ◽

Yu KITADA

Keyword(s):

Fatigue Life ◽

Strain Rate ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Download Full-text