2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
Latest Publications

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26

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5

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Published By IEEE

9781509042784

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Technique for embedding current measurement and ringing suppression within multichip modules

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936766 ◽

2017 ◽

Author(s):

Andrew N. Lemmon ◽

Ali Shahabi

Keyword(s):

Current Measurement ◽

Multichip Modules

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Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936754 ◽

2017 ◽

Author(s):

Tung Ching Lui

Keyword(s):

Lead Free ◽

Lifetime Prediction ◽

Lead Free Solder ◽

Solder Material ◽

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Suppression of electromagnetic interference using screening and shielding techniques within the switching cells

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936762 ◽

2017 ◽

Author(s):

Zhe Zhang ◽

C. Mark Johnson

Keyword(s):

Electromagnetic Interference

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Thermal management for GaN power devices mounted on PCB substrates

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936752 ◽

2017 ◽

Author(s):

Shuangfeng Zhang ◽

Eric Laboure ◽

Denis Labrousse ◽

Stephane Lefebvre

Keyword(s):

Thermal Management ◽

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Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936745 ◽

2017 ◽

Author(s):

Q. Xie ◽

Y. Ohki ◽

N. Hirai ◽

Y-H Cheng

Keyword(s):

High Temperature ◽

Dielectric Property ◽

Epoxy Resin ◽

Resin Composites ◽

Epoxy Resin Composites

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Stacked power module with integrated thermal management

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936764 ◽

2017 ◽

Author(s):

Lauren M. Boteler ◽

Valerie A. Niemann ◽

Damian P. Urciuoli ◽

Steven M. Miner

Keyword(s):

Thermal Management ◽

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Commereializing medium voltage VFD that utilizes high voltage SiC technology

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936759 ◽

2017 ◽

Author(s):

Pana Shenoy ◽

Octavio Solis ◽

Liping Zheng

Keyword(s):

High Voltage ◽

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Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936753 ◽

2017 ◽

Author(s):

Zsolt Toth-Pal ◽

Yafan Zhang ◽

Tag Hammam ◽

Hans-Peter Nee ◽

Mietek Bakowski

Keyword(s):

Silicon Carbide ◽

Contact Resistance ◽

Thermal Contact Resistance ◽

Thermal Contact ◽

Molybdenum Substrate ◽

Thermal Improvement

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Epoxy/h-BN composites based on oriented boron nitride platelets with high thermally conductivity for electronic encapsulation

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936751 ◽

2017 ◽

Author(s):

Zhengdong Wang ◽

Jialiang Huang ◽

Siyu Chen ◽

Mengmeng Yang ◽

Jingya Liu ◽

...

Keyword(s):

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Mission profile analysis and calorimetric loss measurement of a SiC hybrid module for main inverter application of electric vehicles

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2017.7936748 ◽

2017 ◽

Author(s):

Ajay Poonjal Pai ◽

Tomas Reiter ◽

Martin Maerz

Keyword(s):

Electric Vehicles ◽

Profile Analysis ◽

Loss Measurement ◽

Hybrid Module ◽

Mission Profile

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