EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.

Solder joints layout design and reliability enhancement of wafer level packaging

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502807 ◽

2005 ◽

Cited By ~ 14

Author(s):

Chang-Ming Liu ◽

Chang-Chun Lee ◽

Kuo-Ning Chiang

Keyword(s):

Solder Joints ◽

Layout Design ◽

Wafer Level ◽

Wafer Level Packaging ◽

Reliability Enhancement

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Dynamic macromodels for sensor devices

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502771 ◽

2005 ◽

Cited By ~ 1

Author(s):

T. Hauck ◽

M. Thanner ◽

G. O'Brien

Keyword(s):

Sensor Devices

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Muftiphysles for topology optimization in HEMS

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502803 ◽

2005 ◽

Author(s):

J.G. Korvink ◽

Zhenyu Liu

Keyword(s):

Topology Optimization

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Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502769 ◽

2005 ◽

Cited By ~ 4

Author(s):

D. Degryse ◽

B. Vandevelde ◽

E. Beyne

Keyword(s):

Systematic Study ◽

Bonding Process ◽

Cu Bonding ◽

Mechanical Bonding

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The effect of cyclic hardening in copper heat-sinks on die fracture probability

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502816 ◽

2005 ◽

Cited By ~ 3

Author(s):

J. Bielen ◽

M. van Gils ◽

F. Theunis

Keyword(s):

Cyclic Hardening ◽

Fracture Probability ◽

Heat Sinks

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Computer assisted design study of a low-cost pressure sensor

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502860 ◽

2005 ◽

Author(s):

M.H.H. Mcuwissen ◽

E.P. Veninga ◽

M.W.W.J. Tijdink ◽

M.G.H. Meijerink

Keyword(s):

Pressure Sensor ◽

Low Cost ◽

Computer Assisted ◽

Design Study ◽

Computer Assisted Design

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Warpage minimization of the HVQFN map mould

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502794 ◽

2005 ◽

Cited By ~ 11

Author(s):

J.G.J. Beijer ◽

J.H.J. Janssen ◽

H.J.L. Bressers ◽

W.D. van Driel ◽

K.M.B. Jansen ◽

...

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Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502813 ◽

2005 ◽

Author(s):

M. Lindgren ◽

M. Meuwissen ◽

P. Leisner

Keyword(s):

Temperature Cycling ◽

Electronics Assembly

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Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502862 ◽

2005 ◽

Cited By ~ 5

Author(s):

P. Limaye ◽

B. Vandevelde ◽

J. Van de Peer ◽

S. Doaders ◽

R. Darveaux

Keyword(s):

Solder Joint ◽

Design Approach ◽

Lead Free ◽

Reliability Optimization ◽

Probabilistic Design ◽

Solder Joint Reliability ◽

Package Design ◽

Joint Reliability ◽

Bga Package

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Creep of thermally aged SnAgCu-solder joints

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502778 ◽

2005 ◽

Cited By ~ 4

Author(s):

S. Wiese ◽

M. Roellig ◽

K.-J. Wolter

Keyword(s):

Solder Joints ◽

Snagcu Solder

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EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Solder joints layout design and reliability enhancement of wafer level packaging

Dynamic macromodels for sensor devices

Muftiphysles for topology optimization in HEMS

Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

The effect of cyclic hardening in copper heat-sinks on die fracture probability

Computer assisted design study of a low-cost pressure sensor

Warpage minimization of the HVQFN map mould

Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling

Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

Creep of thermally aged SnAgCu-solder joints

Export Citation Format

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Solder joints layout design and reliability enhancement of wafer level packaging

Dynamic macromodels for sensor devices

Muftiphysles for topology optimization in HEMS

Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

The effect of cyclic hardening in copper heat-sinks on die fracture probability

Computer assisted design study of a low-cost pressure sensor

Warpage minimization of the HVQFN map mould

Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling

Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

Creep of thermally aged SnAgCu-solder joints

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.
Latest Publications