EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.

Computer assisted design study of a low-cost pressure sensor

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502860 ◽

2005 ◽

Author(s):

M.H.H. Mcuwissen ◽

E.P. Veninga ◽

M.W.W.J. Tijdink ◽

M.G.H. Meijerink

Keyword(s):

Pressure Sensor ◽

Low Cost ◽

Computer Assisted ◽

Design Study ◽

Computer Assisted Design

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The effect of cyclic hardening in copper heat-sinks on die fracture probability

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502816 ◽

2005 ◽

Cited By ~ 3

Author(s):

J. Bielen ◽

M. van Gils ◽

F. Theunis

Keyword(s):

Cyclic Hardening ◽

Fracture Probability ◽

Heat Sinks

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Solder joints layout design and reliability enhancement of wafer level packaging

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502807 ◽

2005 ◽

Cited By ~ 14

Author(s):

Chang-Ming Liu ◽

Chang-Chun Lee ◽

Kuo-Ning Chiang

Keyword(s):

Solder Joints ◽

Layout Design ◽

Wafer Level ◽

Wafer Level Packaging ◽

Reliability Enhancement

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Dynamic macromodels for sensor devices

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502771 ◽

2005 ◽

Cited By ~ 1

Author(s):

T. Hauck ◽

M. Thanner ◽

G. O'Brien

Keyword(s):

Sensor Devices

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Muftiphysles for topology optimization in HEMS

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502803 ◽

2005 ◽

Author(s):

J.G. Korvink ◽

Zhenyu Liu

Keyword(s):

Topology Optimization

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Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502769 ◽

2005 ◽

Cited By ~ 4

Author(s):

D. Degryse ◽

B. Vandevelde ◽

E. Beyne

Keyword(s):

Systematic Study ◽

Bonding Process ◽

Cu Bonding ◽

Mechanical Bonding

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Creep of thermally aged SnAgCu-solder joints

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502778 ◽

2005 ◽

Cited By ~ 4

Author(s):

S. Wiese ◽

M. Roellig ◽

K.-J. Wolter

Keyword(s):

Solder Joints ◽

Snagcu Solder

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Hybrid experimental and computational approach for rate dependent mechanical properties using indentation techniques

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502858 ◽

2005 ◽

Author(s):

J. Varghese ◽

G. Radig ◽

D. Herkommer ◽

A. Dasgupta

Keyword(s):

Mechanical Properties ◽

Computational Approach ◽

Rate Dependent

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Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502887 ◽

2005 ◽

Cited By ~ 2

Author(s):

N. Van Steenberge ◽

B. Vandevelde ◽

I. Schildermans ◽

G. Willems

Keyword(s):

Finite Element ◽

Thermal Behavior ◽

Lead Free ◽

Finite Element Models ◽

Electronic Assembly

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Modeling and experiments on an isothermal fatigue test for solder joints

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502852 ◽

2005 ◽

Author(s):

S. Ridout ◽

M. Dusek ◽

C. Bailey ◽

C. Hunt

Keyword(s):

Fatigue Test ◽

Solder Joints ◽

Isothermal Fatigue ◽

Modeling And Experiments

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EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Computer assisted design study of a low-cost pressure sensor

The effect of cyclic hardening in copper heat-sinks on die fracture probability

Solder joints layout design and reliability enhancement of wafer level packaging

Dynamic macromodels for sensor devices

Muftiphysles for topology optimization in HEMS

Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

Creep of thermally aged SnAgCu-solder joints

Hybrid experimental and computational approach for rate dependent mechanical properties using indentation techniques

Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Modeling and experiments on an isothermal fatigue test for solder joints

Export Citation Format

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Computer assisted design study of a low-cost pressure sensor

The effect of cyclic hardening in copper heat-sinks on die fracture probability

Solder joints layout design and reliability enhancement of wafer level packaging

Dynamic macromodels for sensor devices

Muftiphysles for topology optimization in HEMS

Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

Creep of thermally aged SnAgCu-solder joints

Hybrid experimental and computational approach for rate dependent mechanical properties using indentation techniques

Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Modeling and experiments on an isothermal fatigue test for solder joints

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.
Latest Publications