scholarly journals Thermal modeling and analysis of storage systems

Author(s):  
Xunfei Jiang ◽  
Mohammed I. Alghamdi ◽  
Ji Zhang ◽  
Maen Al Assaf ◽  
Xiaojun Ruan ◽  
...  
2014 ◽  
Vol 9 (4) ◽  
pp. 299-311 ◽  
Author(s):  
Xunfei Jiang ◽  
Mohammed I. Alghamdi ◽  
Maen M. Al Assaf ◽  
Xiaojun Ruan ◽  
Ji Zhang ◽  
...  

1973 ◽  
Vol 95 (4) ◽  
pp. 1048-1052 ◽  
Author(s):  
J. T. Pogson ◽  
J. L. Franklin

The results of a study on thermal modeling and analysis of hybrid microcircuits are presented. Parametric studies covering typical component mounting methods, bonding agent materials, and component spacing are described. Temperature profiles of substrates, component temperatures, and thermal resistances are presented. It is shown that the use of moly tabs can significantly reduce component temperature levels. Additionally, it is shown that thermal modeling can greatly aid the circuit designer in the layout and preliminary design phases.


Integration ◽  
2010 ◽  
Vol 43 (4) ◽  
pp. 327-341 ◽  
Author(s):  
José L. Ayala ◽  
Arvind Sridhar ◽  
David Cuesta

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