Microprocessor system of automated temperature adjustment

Author(s):  
M.A. Nechaev ◽  
L.S. Udut ◽  
M.V. Kovalenko
1993 ◽  
Author(s):  
John Wawrzynek ◽  
Krste Asanovic ◽  
Brian Kingsbury ◽  
James Beck ◽  
David Johnson

Computer ◽  
1974 ◽  
Vol 7 (8) ◽  
pp. 20-31 ◽  
Author(s):  
Joe Weisbecker

1982 ◽  
Vol 17 (1) ◽  
pp. 45-52 ◽  
Author(s):  
D J Beauchamp ◽  
E G Ellison

A servo-hydraulic test rig capable of applying combined temperature and strain or load cycles has been developed and commissioned. The nature of the test has dictated the specimen form as a hollow, hour-glass type. The critical problem of a suitable extensometer for temperature and strain cycling has been solved. The device designed and produced shows negligible transient temperature effects, has a high resolution of better than 0.1 μm, and is mechanically very stable. The heating and cooling is controlled by an induction heating system with grip cooling; additional cooling is available using compressed air passing through the hollow specimen. The system is capable of following a temperature ramp to within 1°C linearity. The thermal strain associated with a temperature cycle is compensated for using a microprocessor system specially developed for the purpose, which also enables a mechanical strain-stress loop to be plotted during a test. Both ‘in-phase’ and ‘out-of-phase’ temperature/strain cycles have been carried out and development continues to include dwell periods.


Sign in / Sign up

Export Citation Format

Share Document