53rd Electronic Components and Technology Conference, 2003. Proceedings.
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Technique and equipment for rework of flip chips with no flow underfiller

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216539 ◽

2004 ◽

Author(s):

G. Kuerbis ◽

R. Heinze ◽

K. Wolter

Keyword(s):

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Viscoelastic properties of underfill for numerical analysis of flip chip packages

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216336 ◽

2004 ◽

Author(s):

Man-Lung Sham ◽

Jang-Kyo Kim ◽

Joo-Hyak Park

Keyword(s):

Numerical Analysis ◽

Viscoelastic Properties ◽

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Thin film coolers for localized temperature control in optoelectronic integrated circuits

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216295 ◽

2004 ◽

Author(s):

Yan Zhang ◽

J. Christofferson ◽

D. Vashaec ◽

P. Nguven ◽

A. Shakouri

Keyword(s):

Thin Film ◽

Integrated Circuits ◽

Temperature Control ◽

Optoelectronic Integrated Circuits

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Copper foils for high density IC packages - starting from foil/dielectric adhesion

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216549 ◽

2004 ◽

Author(s):

Shichun Qu ◽

R.E. Goffell ◽

R.R. Kieschke

Keyword(s):

High Density ◽

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Mechanical properties of packaging materials -the need and a strategy for an educational module

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216367 ◽

2004 ◽

Author(s):

S. Wiese ◽

K. Wolter

Keyword(s):

Mechanical Properties ◽

Packaging Materials ◽

Educational Module

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Micro-electro-mechanically tunable two-chip vcsels for 1.55 μm

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216375 ◽

2004 ◽

Author(s):

F. Riemenschneider ◽

I. Sagnes ◽

G. Bohm ◽

H. Halbritter ◽

M. Maute ◽

...

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Assembly challenges related to fine pitch in-line and staggered bond pad devices

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216468 ◽

2004 ◽

Author(s):

M. Ruston ◽

Tu Anh Tran ◽

L. Yong ◽

A. Youngblood ◽

D. Ravenscraft ◽

...

Keyword(s):

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3D large deformation and nonlinear stress analyses of tin whisker initiation and growth on lead-free components

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216358 ◽

2004 ◽

Author(s):

J.H. Lau ◽

S.H. Pan ◽

Chen Xa

Keyword(s):

Large Deformation ◽

Lead Free ◽

Tin Whisker ◽

Nonlinear Stress ◽

Stress Analyses

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Evaluation of manufacturing assembly process impact on long term reliability of a high performance ASIC using flip chip hyperBGA pacuage

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216302 ◽

2004 ◽

Author(s):

Jie Xue ◽

K. Hubbard ◽

P. Li ◽

J. Tang ◽

J. Poom ◽

...

Keyword(s):

High Performance ◽

Flip Chip ◽

Assembly Process ◽

Manufacturing Assembly

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Novel multi-layer through-die connections for package to chip power and ground connections

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216345 ◽

2004 ◽

Author(s):

S. Konimera ◽

W. Woods ◽

J.P. Krusius

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