53rd Electronic Components and Technology Conference, 2003. Proceedings.
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Model for BGA and CSP reliability in automotive underhood applications

2004 ◽  
Author(s):  
P. Lail ◽  
N. Islam ◽  
J. Suhling ◽  
R. Darveaux

A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces

2004 ◽  
Author(s):  
Chu-Chung Lee ◽  
Tu-Anh Tran ◽  
L. Yong ◽  
F. Harun ◽  
C.C. Yong
Keyword(s):  
Thermal Aging ◽  
Aging Study

CpW transmission lines on silicon supporting 10G/40G InP EAM chip on carrier applications

2004 ◽  
Author(s):  
Songsheng Tan ◽  
D. Nair ◽  
S.C. Pollard ◽  
L. Hughes ◽  
K. Matthews ◽  
...  
Keyword(s):  
Transmission Lines

Micro-electro-mechanically tunable two-chip vcsels for 1.55 μm

2004 ◽  
Author(s):  
F. Riemenschneider ◽  
I. Sagnes ◽  
G. Bohm ◽  
H. Halbritter ◽  
M. Maute ◽  
...  

Assembly challenges related to fine pitch in-line and staggered bond pad devices

2004 ◽  
Author(s):  
M. Ruston ◽  
Tu Anh Tran ◽  
L. Yong ◽  
A. Youngblood ◽  
D. Ravenscraft ◽  
...  
Keyword(s):  
Fine Pitch
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