Applying material optimization to fracture mechanics analysis to improve the reliability of the plastic IC package in reflow soldering process

The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process shows elastic and viscoelastic behaviors and to suggest the optimum design by the approaches of stress analysis and fracture mechanics. The model for analysis is the plastic Small Outline J-lead package with a dimpled diepad. On the package without a crack, the stress analysis is done and the possibility of delamination is considered. For the model fully delaminated between the chip and the dimpled diepad, J-integrals in low temperature and C(t)-integrals in high temperature are calculated for the various design variables and the fracture integrity is discussed. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

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Application of Stress Optimization for Preventing the Delamination of the Plastic IC Package in Reflow Soldering Process

Transactions of the Korean Society of Mechanical Engineers A ◽

10.3795/ksme-a.2004.28.6.709 ◽

2004 ◽

Vol 28 (6) ◽

pp. 709-716

Keyword(s):

Reflow Soldering ◽

Soldering Process ◽

Stress Optimization ◽

Ic Package

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Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Journal of Electronic Packaging ◽

10.1115/1.2792677 ◽

1999 ◽

Vol 121 (3) ◽

pp. 148-155 ◽

Cited By ~ 10

Author(s):

Kang Yong Lee ◽

Taek Sung Lee

Keyword(s):

Integrated Circuit ◽

Fracture Analysis ◽

Stress Variation ◽

Reflow Soldering ◽

Soldering Process ◽

Ir Heating ◽

Design Variables ◽

Plastic Package ◽

Optimal Values ◽

Ic Package

The purpose of this paper is to evaluate the delamination and fracture integrity of the integrated circuit (IC) plastic package under hygrothermal loading by the approaches of stress analysis and fracture mechanics. The plastic small outline J-lead (SOJ) package with a dimpled diepad under the reflow soldering process of infrared (IR) heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and the dimpled diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal values of design variables to prevent the delamination and fracture of the package are obtained. In this study, the finite difference method (FDM) program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

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Fracture analysis of electronic ic package in reflow soldering process

KSME International Journal ◽

10.1007/bf02996101 ◽

2004 ◽

Vol 18 (3) ◽

pp. 357-369 ◽

Cited By ~ 1

Author(s):

Ji Hyuck Yang ◽

Kang Yong Lee ◽

Taek Sung Lee ◽

She-Xu Zhao

Keyword(s):

Fracture Analysis ◽

Reflow Soldering ◽

Soldering Process ◽

Ic Package

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Fracture Mechanics Analysis for Short Cracks.

10.21236/ada192002 ◽

1987 ◽

Author(s):

B. S. Annigeri

Keyword(s):

Fracture Mechanics ◽

Short Cracks ◽

Mechanics Analysis

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Nonlinear Fracture Mechanics Analysis Considering Material Inhomogeneity of Welded Joints

Impact ◽

10.21820/23987073.2019.10.105 ◽

2019 ◽

Vol 2019 (10) ◽

pp. 105-107

Author(s):

Hiroshi Okada

Keyword(s):

Fracture Mechanics ◽

Solid Mechanics ◽

Crack Nucleation ◽

Intensity Factors ◽

Nonlinear Fracture Mechanics ◽

Material Inhomogeneity ◽

Computational Fracture Mechanics ◽

New Methods ◽

Nonlinear Fracture ◽

Mechanics Analysis

Professor Hiroshi Okada and his team from the Department of Mechanical Engineering, Faculty of Science and Technology, Tokyo University of Science, Japan, are engaged in the field of computational fracture mechanics. This is an area of computational engineering that refers to the creation of numerical methods to approximate the crack evolutions predicted by new classes of fracture mechanics models. For many years, it has been used to determine stress intensity factors and, more recently, has expanded into the simulation of crack nucleation and propagation. In their work, the researchers are proposing new methods for fracture mechanics analysis and solid mechanics analysis.

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