Experiments and Three-Dimensional Modeling of Delamination in an Encapsulated Microelectronic Package Under Thermal Loading

Author(s):  
Siow Ling Ho ◽  
Shailendra P. Joshi ◽  
Andrew A. O. Tay
2011 ◽  
Vol 56 (3) ◽  
pp. 766-770 ◽  
Author(s):  
Delphine Tardivo ◽  
Julien Sastre ◽  
Michel Ruquet ◽  
Lionel Thollon ◽  
Pascal Adalian ◽  
...  

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