Skin Effect Suppressed Ni–Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board
2018 ◽
Vol 54
(11)
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pp. 1-5
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2016 ◽
Vol 23
(4)
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pp. 17-24
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2016 ◽
Vol 75
(18)
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pp. 1657-1663
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1996 ◽
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2002 ◽
Vol 2002
(8)
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