Hole-filling framework by combining structural and textural information for the 3D Terracotta Warriors

Journal of Applied Remote Sensing ◽

10.1117/1.jrs.15.046503 ◽

2021 ◽

Vol 15 (04) ◽

Author(s):

Tong Chu ◽

Wenmin Yao ◽

Jie Liu ◽

Xueli Xu ◽

Haiyang Nan ◽

...

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Research on hole filling algorithm in triangle mesh models

Journal of Computer Applications ◽

10.3724/sp.j.1087.2009.02035 ◽

2009 ◽

Vol 29 (8) ◽

pp. 2035-2037 ◽

Author(s):

Jian-lei TIAN ◽

Xu-min LIU ◽

Yong GUAN

Keyword(s):

Triangle Mesh ◽

Hole Filling ◽

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Optimal Parameters for Modified Butterfly Interpolation Scheme Inspired Configurations as Hole-filling Method in 3D Volume Reconstruction

2020 IEEE Graphics and Multimedia (GAME) ◽

10.1109/game50158.2020.9315085 ◽

2020 ◽

Author(s):

Chan Vei Siang ◽

Farhan Mohamed ◽

Mohd Yazid Idris ◽

Mohd Sharizal Bin Sunar ◽

Ali Bin Selamat ◽

...

Keyword(s):

Optimal Parameters ◽

Interpolation Scheme ◽

Hole Filling ◽

Volume Reconstruction ◽

Filling Method ◽

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Disocclusion-type aware hole filling method for view synthesis

Multimedia Tools and Applications ◽

10.1007/s11042-020-10196-x ◽

2021 ◽

Author(s):

Xiaodong Chen ◽

Haitao Liang ◽

Huaiyuan Xu ◽

Siyu Ren ◽

Huaiyu Cai ◽

...

Keyword(s):

View Synthesis ◽

Hole Filling ◽

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Al-Ge reflow sputtering for submicron-contact-hole filling

1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference ◽

10.1109/vmic.1991.152981 ◽

2002 ◽

Author(s):

K. Kukuta ◽

T. Kikkawa ◽

M. Aoki

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Effects of contact hole filling and multilevel metallization on gate oxide integrity and transistor performance

10.1109/vmic.1990.127853 ◽

2002 ◽

Author(s):

U. Schwalke ◽

G. Roska

Keyword(s):

Hole Filling ◽

Gate Oxide Integrity

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Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

Electrochemical and Solid-State Letters ◽

10.1149/1.1595311 ◽

2003 ◽

Vol 6 (9) ◽

pp. C134 ◽

Author(s):

Wei-Ping Dow ◽

Her-Shu Huang ◽

Zack Lin

Keyword(s):

Chloride Ions ◽

Hole Filling ◽

Copper Electroplating ◽

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Novel temporal domain hole filling based on background modeling for view synthesis

2012 19th IEEE International Conference on Image Processing ◽

10.1109/icip.2012.6467461 ◽

2012 ◽

Author(s):

Wenxiu Sun ◽

Oscar C. Au ◽

Lingfeng Xu ◽

Yujun Li ◽

Wei Hu

Keyword(s):

Background Modeling ◽

View Synthesis ◽

Hole Filling ◽

Temporal Domain

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New studies of non-photochemical holes of dyes and rare-earth ions in polymers. I. Spontaneous hole filling

Chemical Physics ◽

10.1016/0301-0104(86)85092-3 ◽

1986 ◽

Vol 101 (2) ◽

pp. 269-277 ◽

Author(s):

B.L. Fearey ◽

G.J. Small

Keyword(s):

Rare Earth Ions ◽

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Framework for 3D object hole filling

2015 Fifth National Conference on Computer Vision, Pattern Recognition, Image Processing and Graphics (NCVPRIPG) ◽

10.1109/ncvpripg.2015.7490062 ◽

2015 ◽

Author(s):

Shankar Setty ◽

Syed Altaf Ganihar ◽

Uma Mudenagudi

Keyword(s):

Hole Filling ◽

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Hole filling on surfaces by discrete variational splines

Applied Numerical Mathematics ◽

10.1016/j.apnum.2011.11.003 ◽

2012 ◽

Vol 62 (9) ◽

pp. 1050-1060 ◽

Author(s):

M.A. Fortes ◽

P. González ◽

M. Pasadas ◽

M.L. Rodríguez

Keyword(s):

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