The Chemical Resistance of Adhesive Bonds Based on Epoxy Urethan Oligomers Synthesized Using Different Diisocyanates

2021 ◽  
Vol 14 (4) ◽  
pp. 537-539
Author(s):  
A. V. Savchuk ◽  
A. I. Slobodinyuk ◽  
D. G. Slobodinyuk ◽  
E. V. Pogorel’tsev
Author(s):  
L.H. Bolz ◽  
D.H. Reneker

The attack, on the surface of a polymer, by the atomic, molecular and ionic species that are created in a low pressure electrical discharge in a gas is interesting because: 1) significant interior morphological features may be revealed, 2) dielectric breakdown of polymeric insulation on high voltage power distribution lines involves the attack on the polymer of such species created in a corona discharge, 3) adhesive bonds formed between polymer surfaces subjected to such SDecies are much stronger than bonds between untreated surfaces, 4) the chemical modification of the surface creates a reactive surface to which a thin layer of another polymer may be bonded by glow discharge polymerization.


2000 ◽  
Vol 629 ◽  
Author(s):  
John V. St. John ◽  
Patty Wisian-Neilson

ABSTRACTPoly (methylphenylphosphazene) (PMPP) is an example of a unique class of inorganic polymers with alternating – (P=N)– backbones. Chemical modification of bulk PMPP can result in changes of physical properties such as chemical resistance, onset temperature of thermal degradation, elasticity, and flexibility. Surface modification of PMPP allows tailoring of the chemical properties at the polymer interface while maintaining the integrity of the bulk polymer. In this research, PMPP thin films were treated to form carboxylate or carboxylic acid groups at the surface. Surface modification was monitored by following changes in contact angle. The hydrophobic/hydrophilic interactions of carboxylated PMPP surfaces allow for mesoscale interactions of thin polymer films.


2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.


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