In the modern system of process safety management, the procedure for occupational risk assessment and management as a probability of causing damage to health in the performance of work duties has become mandatory for microelectronics enterprises. This procedure involves the use of systematic methods for risk identification, monitoring and analysis, obtained results recording and interpretation, and the necessary reporting preparation. This paper analyzes the risks in the main structural divisions of the microelectronics enterprise and suggests corrective organizational measures to minimize the likelihood of a dangerous event and subsequent damage. The procedure was carried out using the Fine – Kinney method, the most informative approach to risk assessment, taking into account the severity of the incident and its economic consequences for the enterprise. It has been established that the sources of significant risk are typically related to space planning flaws, failure to meet the time limit for X-ray equipment work licensing, absence of draw ventilation, and outmoded system of used lapping slurry collection. These shortcomings elimination opens up the opportunities for occupational hazard class lowering and downward revision in tariffs.
1601h Challenging issues in carbon nanotube occupational risk assessment and management strategies
