COMPARING SEGREGATION PROFILES OF Sn AND Sb IN SINGLE AND POLYCRYSTALLINE Cu

2012 ◽  
Vol 19 (01) ◽  
pp. 1250006
Author(s):  
J. K. O. ASANTE ◽  
W. D. ROOS
Keyword(s):  
Electron Spectroscopy ◽  
Auger Electron ◽  
Indirect Method ◽  
Bulk Diffusion ◽  
Solute Segregation ◽  
Interaction Energies ◽  
Surface Enrichment ◽  
Experimental Conditions ◽  
Low Concentrations ◽  
Equilibrium Segregation

The kinetics as well as the equilibrium segregation profiles of very low concentrations of Sn (0.14 at.%) and Sb (0.12 at.%) in a polycrystalline Cu sample were measured by Auger electron spectroscopy. These profiles were compared to those from a Cu(100) , Sb , Sn ternary single crystal which was subjected to the same experimental conditions. The results are explained in terms of solute segregation to grain boundaries and surface interfaces. The comparison also indicate that not only bulk diffusion, interactions and segregation energies play a role in the surface enrichment of the species, but in polycrystalline samples, the doping order of the specimen is to be considered as well. The differences in interaction energies of Sn and Sb also suggest an indirect method of measuring the concentrations of nonsegregating impurities in polycrystalline samples.

AN UNEXPECTED SURFACE SEGREGATION PHENOMENON OF GOLD ON THE SURFACE OF A Pb(Au) SOLID SOLUTION

1997 ◽  
Vol 04 (06) ◽  
pp. 1139-1141 ◽  
Author(s):  
H. OUGHADDOU ◽  
B. AUFRAY ◽  
J. P. BIBÉRIAN ◽  
J. BERNARDINI
Keyword(s):  
Solid Solution ◽  
Chemical Composition ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Surface Segregation ◽  
Lower Surface ◽  
Surface Equilibrium ◽  
Segregation Phenomenon ◽  
Lower Surface Energy ◽  
Equilibrium Segregation

At 260°C, at the surface of a lead–gold (96·10-6 at/at) solid solution we observe by Auger electron spectroscopy an unexpected surface equilibrium segregation of gold. A quantitative evaluation of the Auger data obtained at the end of the segregation kinetics shows that the segregation of gold is consistent with the formation of a surface alloy with a chemical composition close to AuPb 3, with gold atoms situated under a layer of lead. We propose that this unusual segregation is related to the lower surface energy of this intermetallic compound AuPb 3 compared to the gold and lead ones.

Surface enrichment of the elements in welding fume particles analysed by auger electron spectroscopy

1985 ◽  
Vol 17 (2) ◽  
pp. 182
Author(s):  
V.P. Tanninen ◽  
H.-K. Hyvärinen ◽  
A. Grekula ◽  
E. Ristolainen
Keyword(s):  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Welding Fume ◽  
Surface Enrichment

Examination of Passive Films on Iron-Nickel Alloys by Auger Electron Spectroscopy

CORROSION ◽  
1981 ◽  
Vol 37 (10) ◽  
pp. 549-556 ◽  
Author(s):  
G. T. Burstein
Keyword(s):  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Nickel Alloys ◽  
Auger Electron ◽  
Anodic Films ◽  
Low Concentrations ◽  
Iron Nickel ◽  
Iron Nickel Alloys ◽  
Film Interface ◽  
Film Side

Abstract Detailed analysis of anodic films formed on amorphous iron-nickel alloys containing phosphorus, boron, and molybdenum has been performed by Auger electron spectroscopy. These films contain considerable quantities of P and B both of which are highest at the metal/film interface. Phosphorus accumulates on the metal side of the interface while boron accumulates on the film side, with continuous variation throughout the film thickness. In the film phase, phosphorus shows complex oxidation states. Molybdenum is also found in the films at low concentrations. Polarization curves show that these alloys exhibit greater passivity in 1M HCl than a comparable polycrystalline iron-nickel alloy.

The formation of low temperature Cu3Si in Ag(Cu)/Si structure upon annealing and its effects on adhesion and resistivity

2003 ◽  
Vol 766 ◽  
Author(s):  
Sungjin Hong ◽  
Seob Lee ◽  
Yeonkyu Ko ◽  
Jaegab Lee
Keyword(s):  
Low Temperature ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Si Substrate ◽  
Copper Silicide ◽  
Alloy Films ◽  
Cu Alloy ◽  
Cu Film ◽  
Rapid Drop

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.

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