A New Concept for Adhesion Promotion in Metal–Polymer Systems by Introduction of Covalently Bonded Spacers at the Interface

2008 ◽  
Vol 22 (10-11) ◽  
pp. 1123-1143 ◽  
Author(s):  
J. Friedrich ◽  
R. Mix ◽  
S. Wettmarshausen
2010 ◽  
Vol 3 (1) ◽  
pp. 26-31 ◽  
Author(s):  
I. A. Starostina ◽  
R. M. Khuzakhanov ◽  
E. V. Burdova ◽  
E. K. Sechko ◽  
O. V. Stoyanov

MRS Bulletin ◽  
1995 ◽  
Vol 20 (9) ◽  
pp. 47-51 ◽  
Author(s):  
David C. Martin ◽  
Patricia M. Wilson ◽  
Jun Liao ◽  
Marie-Christine G. Jones

Understanding the influence of local variations in symmetry (“defects”) on the macroscopic properties of polymers in the condensed state is an ongoing experimental and theoretical challenge. Studies of defects in solids require the most information-intensive description of microstructure since it is not possible to describe a “defect” without understanding the morphology of the majority phase as well.The nature of defects in polymers has been discussed elsewhere, including other articles in this issue of the MRS Bulletin. The structure, properties, and mobility of defects in polymers are all profoundly influenced by the covalently bonded chain backbone. In polymers, there are unique defects such as chain folds and twists that have no obvious analogue in materials of small molar mass. Here, we examine a particular type of defect that is present in all polymer systems with finite molecular weight: chain ends. Our interest will focus on chain ends in polymers that are essentially fully extended parallel to a certain preferred orientation axis.The extended-chain microstructure was originally envisioned by Staudinger as a “continuous crystal” in which high-molecular-weight polymers would be perfectly oriented and close-packed together laterally. Extended-chain polymer fibers such as poly(paraphenylene terephthalamide) (PPTA or Kevlar®), gelspun polyethylene (Spectra®), and the rigid-rod polymers poly(paraphenylene benzobisthiazole) (PBZT) and poly(paraphenylene benzobisoxazole (PBZO or PBO) (Structure 1) closely approach this conceptual limit. The outstanding tensile moduli (100–400 GPa) and tensile strengths (2–4 GPa or higher) of these fibers have generated considerable interest for lightweight structural applications. Extendedchain polymers can also be prepared by solid-state polymerizations of appropriate monomer precursors. Perhaps the most familiar of this latter class of materials are the polydi-acetylenes, first developed by Wegner.


1979 ◽  
Vol 17 (10) ◽  
pp. 3193-3203 ◽  
Author(s):  
V. A. Belyi ◽  
V. A. Goldade ◽  
A. S. Neverov ◽  
L. S. Pinchuk

2016 ◽  
pp. 209-212
Author(s):  
G. B. Yuldasheva ◽  
A. A. Riskulov ◽  
J. S. Avliyokulov ◽  
A. A. Abdurazakov

2007 ◽  
Vol 55 (8) ◽  
pp. 2757-2764 ◽  
Author(s):  
R. van Tijum ◽  
W.P. Vellinga ◽  
J.Th.M. De Hosson

MRS Advances ◽  
2016 ◽  
Vol 1 (1) ◽  
pp. 15-20 ◽  
Author(s):  
Jake Rabinowitz ◽  
Gregory Fritz ◽  
Parshant Kumar ◽  
Peter Lewis ◽  
Mikel Miller ◽  
...  

ABSTRACTIn this work, we propose a model to quantify strain induced conductor discontinuities based on measuring electrical resistance while applying tensile strain to metal-polymer systems. Under strain, changing conductor geometry and induced conductor discontinuity increase electrical resistance. On Kapton substrates strained to ε = .07, evaporated gold films did not deform and resistance increase was only caused by geometry change. Conversely, discontinuity caused 31% and 72% of the resistance increase in evaporated and printed silver films at the same strain. On PDMS substrates, the same magnitude of discontinuity, causing 31% of the resistance increase, occurred at only ε = .024 in evaporated silver films. At the same strain, discontinuity caused 86% of the resistance increase in evaporated gold films. Printed silver films were inelastic. The results suggest that traditional fabrication techniques may be more suitable to flexible hybrid electronics applications than additively manufactured conductors.


2004 ◽  
Vol 52 (20) ◽  
pp. 5815-5828 ◽  
Author(s):  
Ho-Young Lee ◽  
Yong-Hyup Kim ◽  
Young-Keun Chang

Nanopackaging ◽  
2018 ◽  
pp. 129-183 ◽  
Author(s):  
Olaf van der Sluis ◽  
Nancy Iwamoto ◽  
Jianmin Qu ◽  
Shaorui Yang ◽  
Cadmus Yuan ◽  
...  

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