The Effect of Mineral Powder on the Surface/Interface of Aggregates and Asphalt

This paper attempts to analyze the effect of mineral powder on the adhesion of aggregates and asphalt. First, it employs the gravimetric method to quantitatively analyze the peeling rate of asphalt and asphalt mortar from the surface of basalt, andesite, and limestone aggregates. Then, it takes microscopic pictures of the mineral powder adhered on the surface of the aggregates to observe the distribution of mineral powder in the asphalt mixtures, and uses profiles to analyze the adhesion status of mineral powder on the surface of the aggregates. At last, this paper analyzes the effect of mineral powder particles on the surface/interface of the aggregates and asphalt, and the results indicate that mineral powder has increased the roughness of the surface of the aggregates, therefore it indirectly promotes the adhesion of asphalt on the surface of the aggregates; the mineral powder particles interact with the surface texture of the aggregates, forming an embedding and wedging structure in the texture; compared with aggregates with smooth surface, the adhesion promotion effect is stronger.

Atmospheric pressure plasma liquid assisted deposition of polydopamine/acrylate copolymer on zirconia (Y-TZP) ceramics: a biocompatible and adherent nanofilm

Polydopamine–ethylene glycol dimethacrylate copolymer is a biocompatible coating with cell adhesion promotion and antibiofilm properties.

Development in Additive Methods in Aramid Fiber Surface Modification to Increase Fiber-Matrix Adhesion: A Review

This review article highlights and summarizes the recent developments in the field of surface modification methods for aramid fibers. Special focus is on methods that create a multifunctional fiber surface by incorporating nanostructures and enabling mechanical interlocking. To give a complete picture of adhesion promotion with aramids, the specific questions related to the challenges in aramid-matrix bonding are also shortly presented. The main discussion of the surface modification approaches is divided into sections according to how material is added to the fiber surface; (1) coating, (2) grafting and (3) growing. To provide a comprehensive view of the most recent developments in the field, other methods with similar outcomes, are also shortly reviewed. To conclude, future trends and insights are discussed.

Improvement of Asphalt-Aggregate Adhesion Using Plant Ash Byproduct

The adhesion bonding between asphalt and aggregate significantly influences field performance and durability of asphalt pavement. Adhesion promoters are typically used to improve asphalt-aggregate bonding and minimize moisture-related pavement damage, such as cracking and raveling. This study evaluated the effectiveness of plant ash byproduct as adhesion promoter to improve asphalt-aggregate adhesion performance. Three commonly used aggregate types (granite, basic rock, and limestone) and two asphalt binder types were used in laboratory testing. A modified stripping test method was developed to evaluate test results with image analysis and measurement of asphalt film thickness. The contact angle test and scanning electron microscopy (SEM) with energy disperse spectroscopy (EDS) were conducted. Test results showed that plant ash lixivium significantly improved asphalt-aggregate adhesion. Among three aggregate types, granite yielded the worst asphalt-aggregate adhesion for both control and treated specimens. The effectiveness of adhesion promotion varied depending on the type of asphalt or aggregate and temperature. The SEM/EDS observations showed that the mesh-like crystalline was formed at the interface between asphalt binder and aggregate in the treated specimen, which was believed to enhance the interfacial bonding and prevent asphalt film peeling off from aggregate.

Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass

With the trends towards miniaturization and heterogeneous integration, both IC and advanced substrate manufacturers are striving to meet the needs of next generation platforms, to increase the density of interconnects, and generate conductors featuring finer lines and spaces. Advanced manufacturing technologies such as Semi-Additive-Processing (SAP) and Advanced Modified-Semi-Additive-Processing (amSAP) were devised, realized and implemented in order to meet these requirements. Line and space (L/S) requirements of copper conductors will be below 5/5μm for advanced substrates, with 2/2μm L/S required for chip to chip connections in the near future. Herein we report about the performance of the new developed ferric sulfate based EcoFlash™ process for SAP and amSAP application with the focus on glass as the substrate and VitroCoat as thin metal oxide adhesion promotion layer. The adhesion promotion layer (about 5–10 nm thickness) is dip-coated by a modified sol-gel process followed by sintering which creates chemical bonds to the glass. The sol-gel dip coating process offers good coating uniformity on both Though-Glass-Via (TGV) and glass surfaces under optimized coating conditions. Uniform coating can be achieved up to aspect ratios of 10:1 by using a 300μm thick glass with 30μm diameter TGV. The thin adhesive layer enables electroless and electrolytic copper plating directly onto glass substrates. Excellent adhesion of electroless plated copper seed layer on glass can be achieved by using the adhesive layer and annealing technology. The thin adhesive layer is non-conductive and can be easily removed from the area between circuit traces together with the electroless copper seed layer by etching with a ferric sulfate based process. We have successfully integrated the adhesion layer and electroless and electrolytic copper plating technologies into semi-additive process and seed layer etching capable producing L/S below 10 μm.