Monoclonal Antibodies: Production, Purification, Analysis, Quality Control, Storage, and Distribution

2013 ◽  
pp. 79-104
2017 ◽  
pp. 305-361 ◽  
Author(s):  
Anne-Lise Marie ◽  
Grégory Rouby ◽  
Emmanuel Jaccoulet ◽  
Claire Smadja ◽  
Nguyet Thuy Tran ◽  
...  

Antibodies ◽  
2012 ◽  
Vol 1 (3) ◽  
pp. 259-272 ◽  
Author(s):  
Yukie Murakami-Yamaguchi ◽  
Junko Hirose ◽  
Kumiko Kizu ◽  
Fumiko Okazaki ◽  
Wataru Fujii ◽  
...  

ChemInform ◽  
2003 ◽  
Vol 34 (7) ◽  
Author(s):  
Apostolos Kiritsakis ◽  
Antonis Kanavouras ◽  
Konstantinos Kiritsakis

1985 ◽  
Vol 68 (5) ◽  
pp. 921-924
Author(s):  
Dean F Hill

Abstract Although the overall quality assurance concepts and goals for pesticide formulation analysis are similar to those required of an environmental or trace level analysis laboratory, some important distinctions exist, particularly for quality control. Generally, target levels (label values) are known and pesticide identification can be assumed, thus minimizing the need for verification of pesticide identity and for detailed confirmation of quantitative results reasonably close to the label value. Exceptions are cross-contaminant screening and by-product analysis. Quality control efforts in the formulation laboratory are concentrated on those samples falling outside the established acceptance criteria. The use of official (AOAC/Collaborative International Pesticides Analytical Council (CIPAC)) methodology, replicate determinations, second analyst confirmation, and alternative methodology (if necessary) is stressed. Specific attention must also be paid to the quality and preparation of analytical reference standards.


1998 ◽  
Vol 68 (6) ◽  
pp. 1474S-1479S ◽  
Author(s):  
T Song ◽  
K Barua ◽  
G Buseman ◽  
P A Murphy

1997 ◽  
Vol 5 (9) ◽  
pp. 8-11
Author(s):  
Joseph Rubin ◽  
Tim Hazeldine

The planarizing technique of materials lapping and polishing shows many benefits in providing samples for optical microscopy in failure analysis, quality control and related fields. A method is described below which provides both rapid and accurate micro-sections of pcb's, wafers, packaged components and other processed materials, with the use of a novel approach involving a 'calibrated' polishing base and a 'Micropositioner' head. Other benefits include the ability to halt material removal at a predetermined process endpoint and convenient sample mounting techniques.


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