scholarly journals A Fast-Result Method of Planar Polishing for Optical Microscopy

1997 ◽  
Vol 5 (9) ◽  
pp. 8-11
Author(s):  
Joseph Rubin ◽  
Tim Hazeldine
Keyword(s):  
Quality Control ◽  
Failure Analysis ◽  
Optical Microscopy ◽  
Material Removal ◽  
Novel Approach ◽  
Analysis Quality

The planarizing technique of materials lapping and polishing shows many benefits in providing samples for optical microscopy in failure analysis, quality control and related fields. A method is described below which provides both rapid and accurate micro-sections of pcb's, wafers, packaged components and other processed materials, with the use of a novel approach involving a 'calibrated' polishing base and a 'Micropositioner' head. Other benefits include the ability to halt material removal at a predetermined process endpoint and convenient sample mounting techniques.

Failure Analysis of Electronic and Microelectronic Components with a New Automatic Target Preparation System

2005 ◽  
Author(s):  
Katja Reiter ◽  
Hans Bundgaard
Keyword(s):  
Failure Analysis ◽  
Automatic System ◽  
Material Removal ◽  
Electronics Packaging ◽  
Target Preparation ◽  
Packaging Industry ◽  
Short Time ◽  
Microelectronic Components ◽  
Automatic Preparation ◽  
Excellent Reproducibility

Abstract Based on the requirements regarding target, reproducibility, and specimen surface quality, an automatic system for controlled material removal and target preparation has been developed. The tool is for metallographic failure analysis of electric and microelectronic components, and provides an accuracy of 5 micrometer. This article presents details of sample preparation and device evaluation methods. The images presented show typical objects of examination in the analysis of microstructures and materials in the electronics packaging industry with brief comments. For automatically controlled material removal and preparation, the tool offers alignment and measuring of the sample prior to the preparation. The desired preparation layers were achieved precisely and reproducibly with several specimens of the same kind. The automatic preparation system allowed the preparation of critical samples within a short time, with high precision and with excellent reproducibility.

A New Deprocess Flow of Failure Analysis for MEMS Motion Sensor

2013 ◽  
Author(s):  
Chun-An Huang ◽  
Han-Yun Long ◽  
King-Ting Chiang ◽  
Li Chuang ◽  
Kevin Tsui
Keyword(s):  
Failure Analysis ◽  
Optical Microscopy ◽  
Motion Sensor ◽  
Thermal System ◽  
Layer By Layer ◽  
Sensor Failure ◽  
Process Flow ◽  
New Process ◽  
Cutting System ◽  
Successful Observation

Abstract This paper demonstrates a new de-process flow for MEMS motion sensor failure analysis, using layer by layer deprocessing to locate defect points. Analysis tools used in this new process flow include IR optical microscopy, thermal system, SEM and a cutting system to de-process of MEMS motion sensor and successful observation defect points.

scholarly journals Combine TEM with TCAD Simulation - A Novel Approach in Failure Analysis

2021 ◽  
Vol 27 (S1) ◽  
pp. 1548-1549
Author(s):  
Yu Zhang ◽  
Satish Kodali ◽  
Edmund Banghart ◽  
Travis Mitchell ◽  
Frieder Baumann
Keyword(s):  
Failure Analysis ◽  
Novel Approach ◽  
Tcad Simulation

Chemical Analysis, Quality Control and Packaging Issues of Olive Oil

ChemInform ◽  
2003 ◽  
Vol 34 (7) ◽  
Author(s):  
Apostolos Kiritsakis ◽  
Antonis Kanavouras ◽  
Konstantinos Kiritsakis
Keyword(s):  
Quality Control ◽  
Chemical Analysis ◽  
Olive Oil ◽  
Analysis Quality

Quality Assurance in the Pesticide Product Laboratory

1985 ◽  
Vol 68 (5) ◽  
pp. 921-924
Author(s):  
Dean F Hill
Keyword(s):  
Quality Control ◽  
Quality Assurance ◽  
Product Analysis ◽  
Pesticide Formulation ◽  
Analysis Laboratory ◽  
Quantitative Results ◽  
Alternative Methodology ◽  
Formulation Analysis ◽  
Analysis Quality ◽  
Level Analysis

Abstract Although the overall quality assurance concepts and goals for pesticide formulation analysis are similar to those required of an environmental or trace level analysis laboratory, some important distinctions exist, particularly for quality control. Generally, target levels (label values) are known and pesticide identification can be assumed, thus minimizing the need for verification of pesticide identity and for detailed confirmation of quantitative results reasonably close to the label value. Exceptions are cross-contaminant screening and by-product analysis. Quality control efforts in the formulation laboratory are concentrated on those samples falling outside the established acceptance criteria. The use of official (AOAC/Collaborative International Pesticides Analytical Council (CIPAC)) methodology, replicate determinations, second analyst confirmation, and alternative methodology (if necessary) is stressed. Specific attention must also be paid to the quality and preparation of analytical reference standards.

scholarly journals Soy isoflavone analysis: quality control and a new internal standard

1998 ◽  
Vol 68 (6) ◽  
pp. 1474S-1479S ◽  
Author(s):  
T Song ◽  
K Barua ◽  
G Buseman ◽  
P A Murphy
Keyword(s):  
Quality Control ◽  
Internal Standard ◽  
Soy Isoflavone ◽  
Analysis Quality
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