scholarly journals Measurement on Thermal Conductivity of Pine Wood Dust Filled Epoxy Composites

2014 ◽  
Vol 2 (4) ◽  
pp. 114-119 ◽  
Author(s):  
Ramesh Chandra Mohapatra ◽  
Antaryami Mishra ◽  
Bibhuti Bhushan Choudhury
2017 ◽  
Vol 21 (1 Part A) ◽  
pp. 199-210 ◽  
Author(s):  
Ramesh Mohapatra ◽  
Antaryami Mishra ◽  
Bibhuti Choudhury

In the present investigation the Thermal conductivity in particulate filler filled (Pine wood dust) epoxy composites at different volume fractions (6.5%, 11.3%,26.8% and 35.9%) have been determined experimentally by using Forced Convection apparatus. The composites of pine wood dust particles of 150 micron size have been prepared by using hand-lay-up technique. The experimental results show that the incorporation of pine wood dust results in reduction of thermal conductivity of epoxy resin and there by improves its thermal insulation capability. From the experiments it is also observed that the composite with 35.9% volume fraction of pine wood dust exhibited lowest thermal conductivity i.e 0.246 W/m-0K on comparison to 6.5%,11.3% and26.8% volume fractions. Therefore the composite with 35.9% wood dust may be more suitable for insulation application. Experimental results (22mm pipe diameter) are also compared with theoretical models such as Rule of mixture model, Maxwell model, Russell model and Baschirow & Selenew model to describe the variation of thermal conductivity versus the volume fraction of the filler. All these models exhibited results close to each other at low dust filler content. On comparison, It has been found that the errors associated with experimental (26mm Dia.) along with all the above four models with respect to experimental ones (22mm Dia.) lie in the range of 19.60 to 44.10%, 0.76 to 12.10%, 1.86 to 5.12% and 8.24 to 19.68% respectively.


2021 ◽  
Vol 209 ◽  
pp. 108760
Author(s):  
Yang Hu ◽  
Chao Chen ◽  
Yingfeng Wen ◽  
Zhigang Xue ◽  
Xingping Zhou ◽  
...  

Author(s):  
Zulfiqar Ali ◽  
Xiangdong Kong ◽  
Maohua Li ◽  
Xiao Hou ◽  
Linhong Li ◽  
...  

Polymers ◽  
2021 ◽  
Vol 13 (6) ◽  
pp. 980
Author(s):  
Xinfeng Wu ◽  
Yuan Gao ◽  
Tao Jiang ◽  
Lingyu Zheng ◽  
Ying Wang ◽  
...  

The heat generated by a high-power device will seriously affect the operating efficiency and service life of electronic devices, which greatly limits the development of the microelectronic industry. Carbon fiber (CF) materials with excellent thermal conductivity have been favored by scientific researchers. In this paper, CF/carbon felt (CF/C felt) was fabricated by CF and phenolic resin using the “airflow network method”, “needle-punching method” and “graphitization process method”. Then, the CF/C/Epoxy composites (CF/C/EP) were prepared by the CF/C felt and epoxy resin using the “liquid phase impregnation method” and “compression molding method”. The results show that the CF/C felt has a 3D network structure, which is very conducive to improving the thermal conductivity of the CF/C/EP composite. The thermal conductivity of the CF/C/EP composite reaches 3.39 W/mK with 31.2 wt% CF/C, which is about 17 times of that of pure epoxy.


Author(s):  
Xianzhe Wei ◽  
Guoqiang Yin ◽  
Xiangyang Zhou ◽  
Linhong Li ◽  
Maohua Li ◽  
...  

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