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1508 Thermal Fatigue Life Analysis of a Thermo Module
The Proceedings of The Computational Mechanics Conference
◽
10.1299/jsmecmd.2009.22.718
◽
2009
◽
Vol 2009.22
(0)
◽
pp. 718-719
Author(s):
Mitsuyoshi Tsutsumi
◽
Keiji Ogi
◽
Manabu Takahashi
◽
Nobuhiro Settu
◽
Nagatoshi Okabe
Keyword(s):
Fatigue Life
◽
Thermal Fatigue
◽
Thermal Fatigue Life
◽
Life Analysis
◽
Fatigue Life Analysis
Download Full-text
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2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
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◽
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◽
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◽
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Thermal fatigue life analysis and forecast of PBGA solder joints on the flexible PCB based on finite element analysis
2008 International Conference on Electronic Packaging Technology & High Density Packaging
◽
10.1109/icept.2008.4607162
◽
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◽
Cited By ~ 2
Author(s):
Huang Chunyue
Keyword(s):
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◽
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◽
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Thermal fatigue life and improvement mechanism of Fe-based coatings on H13 extrusion die by laser additive remanufacturing
Surface and Coatings Technology
◽
10.1016/j.surfcoat.2020.126808
◽
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◽
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Author(s):
Haifei Lu
◽
Jie Cai
◽
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◽
Fei Xing
◽
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◽
...
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Fatigue Life
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Thermal Fatigue
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Fatigue life analysis of steel bicycle frame according to ISO 4210
Engineering Failure Analysis
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10.1016/j.engfailanal.2020.105195
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Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
Engineering Failure Analysis
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◽
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Author(s):
Joshua A. Depiver
◽
Sabuj Mallik
◽
Emeka H. Amalu
Keyword(s):
Fatigue Life
◽
Thermal Fatigue
◽
Solder Joints
◽
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◽
Thermal Fatigue Life
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Fatigue life analysis of a new semi-trailer frame based on FEA method
2010 IEEE 11th International Conference on Computer-Aided Industrial Design & Conceptual Design 1
◽
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◽
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◽
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Wang Feng
◽
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Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
◽
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◽
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◽
Xunping Li
◽
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Bending Fatigue Life Analysis of Carburized Components Using Strain Life and Fracture Mechanics Approaches
10.4271/2003-01-1307
◽
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◽
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Author(s):
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◽
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◽
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Fatigue Life
◽
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◽
Bending Fatigue
◽
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Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
MATERIALS TRANSACTIONS
◽
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◽
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◽
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◽
pp. 809-813
◽
Cited By ~ 10
Author(s):
Young-Eui Shin
◽
Kyung-Woo Lee
◽
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◽
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◽
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Keyword(s):
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Fatigue Life
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Thermal Fatigue
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