2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
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9781538612385
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A high-isolation ku-band SPDT switch in 0.35μm SiGe BiCMOS technology

2017 ◽  
Author(s):  
Zhe Fan ◽  
Kaixue Ma ◽  
Shouxian Mou ◽  
Fanyi Meng
Keyword(s):  
High Isolation ◽  
Bicmos Technology ◽  
Sige Bicmos ◽  
Ku Band

Comparison of thermal stress under TCT between SiC and Si power devices using direct chip-bonding with ag sintered layer on Cu plate

2017 ◽  
Author(s):  
Masaki Kanemoto ◽  
Masaaki Aoki ◽  
Akihiro Mochizuki ◽  
Yoshio Murakami ◽  
Mutsuharu Tsunoda ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Power Devices ◽  
Sintered Layer

A compact filtering power divider based on SIW triangular cavities

2017 ◽  
Author(s):  
Yujie Wang ◽  
Chunxia Zhou ◽  
Kang Zhou ◽  
Wen Wu
Keyword(s):  
Power Divider
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