2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications

TOTAL DOCUMENTS

161

(FIVE YEARS 0)

H-INDEX

4

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Published By IEEE

9781538612385

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal fatigue life analysis of defective solder joints based on engelmaier fatigue model

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277021 ◽

2017 ◽

Author(s):

Jianwei Zuo ◽

Guicui Fu ◽

Yutai Su ◽

Maogong Jiang

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Solder Joints ◽

Thermal Fatigue Life ◽

Fatigue Model ◽

Life Analysis ◽

Fatigue Life Analysis

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Research on self-powered short-circuit fault alarming system in power grid

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277053 ◽

2017 ◽

Author(s):

Shulin Liu ◽

Dandan Xu

Keyword(s):

Short Circuit ◽

Self Powered ◽

Short Circuit Fault

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A novel tapered HTS microstrip bandstop EBG structure

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276973 ◽

2017 ◽

Author(s):

Yan Li ◽

Xiao-chun Li ◽

Jun-fa Mao

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Evaluation of thick monopole in rectangular cavity: An analytic approach

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276905 ◽

2017 ◽

Author(s):

Qi Wu

Keyword(s):

Rectangular Cavity ◽

Analytic Approach

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Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277008 ◽

2017 ◽

Author(s):

Jian-Chun Liu ◽

Long Xiao ◽

Zhi-Jun Yue ◽

Gong Zhang

Keyword(s):

High Temperature ◽

Solder Joints ◽

Atomic Diffusion ◽

High Temperature Aging ◽

Temperature Aging

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Investigation of electrical discontinuity in flip-chip package

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276930 ◽

2017 ◽

Author(s):

Yanbo Xu ◽

Xiaoli Yang ◽

Yan Li ◽

Panpan Zuo ◽

Hongxing Zheng ◽

...

Keyword(s):

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The influence of anti-pad array on the inductance of PCB power net area fill

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8277012 ◽

2017 ◽

Author(s):

Qixuan Sun ◽

Siqi Bai ◽

James L. Drewniak ◽

Erping Li

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CMOS 90 nm multi-bias transistor model Up to 66 GHz

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276926 ◽

2017 ◽

Author(s):

Yunqiu Wu ◽

Shili Cong ◽

Chenxi Zhao ◽

Huihua Liu ◽

Kai Kang

Keyword(s):

Transistor Model

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Physical-based simulation of DC characteristics of hydrogen-terminated diamond MOSFETs

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276947 ◽

2017 ◽

Author(s):

Yu Fu ◽

Yuehang Xu ◽

Ruimin Xu ◽

Jianjun Zhou ◽

Yuechan Kong

Keyword(s):

Dc Characteristics

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Development of advanced AlGaN/GaN HEMTs large signal model

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2017.8276935 ◽

2017 ◽

Author(s):

Yuehang Xu ◽

Shuman Mao

Keyword(s):

Large Signal ◽

Signal Model ◽

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