2016 17th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

340

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781509013968

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583285 ◽

2016 ◽

Author(s):

Han Jiang ◽

Shui-Bao Liang ◽

Hui-Hui Yuwen ◽

Xin-Ping Zhang

Keyword(s):

Finite Element ◽

Size Effect ◽

Finite Element Simulation ◽

Thermal Fatigue ◽

Solder Bump ◽

Fatigue Behavior ◽

Element Simulation ◽

Thermal Fatigue Behavior

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Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583378 ◽

2016 ◽

Cited By ~ 1

Author(s):

Qiang Wen ◽

Xunping Li ◽

Guoyuan Li

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Solder Joints ◽

Thermal Fatigue Life ◽

Snpb Solder

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Investigation of jet printing performance of lead-free solder paste

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583230 ◽

2016 ◽

Cited By ~ 3

Author(s):

Saipeng Li ◽

Yanqing Wang ◽

Jian Zhou ◽

Feng Xue

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Jet Printing ◽

Free Solder

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Study on TSV-Cu protrusion under different annealing conditions and optimization

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583158 ◽

2016 ◽

Author(s):

Qi Deng ◽

Lingang Huang ◽

Jing Shang ◽

Ming Li

Keyword(s):

Annealing Conditions

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Investigation on the defect induced thermal mechanical stress for TSV

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583231 ◽

2016 ◽

Cited By ~ 2

Author(s):

Fei Li ◽

Chengdi Xiao ◽

Hu He ◽

Junhui Li ◽

Wenhui Zhu

Keyword(s):

Mechanical Stress

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In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583089 ◽

2016 ◽

Author(s):

Jinfeng Zeng ◽

Hongru Ma ◽

Xun Tian ◽

Yanqing Ma

Keyword(s):

Hydrothermal Synthesis ◽

Silver Nanoparticle ◽

Conductive Adhesive ◽

Electrically Conductive ◽

Electrically Conductive Adhesive

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A new dual band Wilkinson power divider

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583403 ◽

2016 ◽

Author(s):

Peng Liu ◽

Dan Yang

Keyword(s):

Power Divider ◽

Dual Band ◽

Wilkinson Power Divider

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Integrated circuit ESD protection structure failure analysis based on TLP technique

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583354 ◽

2016 ◽

Cited By ~ 1

Author(s):

Jiang Xie ◽

Qian Shi ◽

Yue Gao

Keyword(s):

Failure Analysis ◽

Integrated Circuit ◽

Esd Protection

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Thermal and flow characteristics of device integrated metallic foam heat sinks with central impingement flow

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583179 ◽

2016 ◽

Cited By ~ 1

Author(s):

H.Y. Zhang ◽

C. Li ◽

P.Q. Fan

Keyword(s):

Flow Characteristics ◽

Heat Sinks ◽

Metallic Foam

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The failure mechanism investigation of the polymer ball interconnected CBGA under board level thermal mechanical stress

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583278 ◽

2016 ◽

Author(s):

Jeffrey ChangBing Lee ◽

Cheng-Chih Chen ◽

Dem Lee ◽

Alice Lin

Keyword(s):

Mechanical Stress ◽

Failure Mechanism ◽

Board Level

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure

Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints

Investigation of jet printing performance of lead-free solder paste

Study on TSV-Cu protrusion under different annealing conditions and optimization

Investigation on the defect induced thermal mechanical stress for TSV

In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive

A new dual band Wilkinson power divider

Integrated circuit ESD protection structure failure analysis based on TLP technique

Thermal and flow characteristics of device integrated metallic foam heat sinks with central impingement flow

The failure mechanism investigation of the polymer ball interconnected CBGA under board level thermal mechanical stress

2016 17th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications