2016 17th International Conference on Electronic Packaging Technology (ICEPT)

2016 ◽

Cited By ~ 1

Author(s):

Ping Zhang ◽

Hong Li ◽

Xujia Xu ◽

Yong Zhuo ◽

Zirui Liu

Keyword(s):

Lead Free ◽

Melting Glass ◽

Glass Packaging

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Advanced packaging lithography and inspection solutions for next generation FOWLP-FOPLP processing

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583315 ◽

2016 ◽

Cited By ~ 3

Author(s):

Keith Best ◽

Gurvinder Singh ◽

Roger McCleary

Keyword(s):

Next Generation ◽

Advanced Packaging

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Dynamic analysis of piezo-based accelerometer with asymmetric gapped cantilever array

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583346 ◽

2016 ◽

Author(s):

Zhang Luo ◽

Chaojun Liu ◽

Shuai Yu ◽

Sheng Liu ◽

Yong Xu

Keyword(s):

Dynamic Analysis ◽

Cantilever Array

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Simulation based selection of the molding compound for power packaging based on the case study of D2PAK

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583251 ◽

2016 ◽

Author(s):

Karthik Doddaballapura ◽

Yan Hong ◽

Gromala Przemyslaw Jakub

Keyword(s):

Molding Compound ◽

Simulation Based ◽

Selection Of

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Investigation on graphene/Ag nano-particles composite ink for flexible electronics

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583208 ◽

2016 ◽

Author(s):

Haixin Zhu ◽

Nantian Nie ◽

Fuliang Wang

Keyword(s):

Flexible Electronics ◽

Nano Particles

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Temperature monitoring of phosphor/silicone mixture in multichip-on board packaged light-emitting diodes with Bragg grating-based sensor

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583337 ◽

2016 ◽

Author(s):

Quan Chen ◽

Min Wang ◽

Shengjun Zhou ◽

Sheng Liu

Keyword(s):

Light Emitting Diodes ◽

Temperature Monitoring ◽

Bragg Grating ◽

Light Emitting

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Using wavelength modulation spectroscopy technique to detect trace ammonia gas in near-infrared spectral region

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583314 ◽

2016 ◽

Author(s):

Jiangping Sun ◽

Guo Zhu ◽

Xiongxiong Guo ◽

Libin Zhang ◽

Xixi Zou ◽

...

Keyword(s):

Spectral Region ◽

Near Infrared ◽

Wavelength Modulation Spectroscopy ◽

Wavelength Modulation ◽

Spectroscopy Technique ◽

Ammonia Gas ◽

Modulation Spectroscopy ◽

Infrared Spectral Region ◽

Infrared Spectral

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Novel fabrication method of LED freeform lens based on electrohydrodynamic

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583365 ◽

2016 ◽

Author(s):

Zhili Zhao ◽

Huai Zheng ◽

Xing Guo ◽

Zefeng Zhang ◽

Jinchao Chu ◽

...

Keyword(s):

Fabrication Method ◽

Freeform Lens

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Investigation on the defect induced thermal mechanical stress for TSV

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583231 ◽

2016 ◽

Cited By ~ 2

Author(s):

Fei Li ◽

Chengdi Xiao ◽

Hu He ◽

Junhui Li ◽

Wenhui Zhu

Keyword(s):

Mechanical Stress

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In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583089 ◽

2016 ◽

Author(s):

Jinfeng Zeng ◽

Hongru Ma ◽

Xun Tian ◽

Yanqing Ma

Keyword(s):

Hydrothermal Synthesis ◽

Silver Nanoparticle ◽

Conductive Adhesive ◽

Electrically Conductive ◽

Electrically Conductive Adhesive

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Preparation of lead-free low-melting glass and its slurry for vacuum glass packaging

Advanced packaging lithography and inspection solutions for next generation FOWLP-FOPLP processing

Dynamic analysis of piezo-based accelerometer with asymmetric gapped cantilever array

Simulation based selection of the molding compound for power packaging based on the case study of D2PAK

Investigation on graphene/Ag nano-particles composite ink for flexible electronics

Temperature monitoring of phosphor/silicone mixture in multichip-on board packaged light-emitting diodes with Bragg grating-based sensor

Using wavelength modulation spectroscopy technique to detect trace ammonia gas in near-infrared spectral region

Novel fabrication method of LED freeform lens based on electrohydrodynamic

Investigation on the defect induced thermal mechanical stress for TSV

In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive

Export Citation Format

2016 17th International Conference on Electronic Packaging Technology (ICEPT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Preparation of lead-free low-melting glass and its slurry for vacuum glass packaging

Advanced packaging lithography and inspection solutions for next generation FOWLP-FOPLP processing

Dynamic analysis of piezo-based accelerometer with asymmetric gapped cantilever array

Simulation based selection of the molding compound for power packaging based on the case study of D2PAK

Investigation on graphene/Ag nano-particles composite ink for flexible electronics

Temperature monitoring of phosphor/silicone mixture in multichip-on board packaged light-emitting diodes with Bragg grating-based sensor

Using wavelength modulation spectroscopy technique to detect trace ammonia gas in near-infrared spectral region

Novel fabrication method of LED freeform lens based on electrohydrodynamic

Investigation on the defect induced thermal mechanical stress for TSV

In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive

2016 17th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications