scholarly journals 1713 Evaluation of Residual Stress in Semiconductor Chips Caused by the Combination of Materials in Packages Using Piezoresistive Test Chips and the Digital Image Correlation Method

2010 ◽  
Vol 2010.23 (0) ◽  
pp. 462-464
Author(s):  
Kazutoshi MATSUDA ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI
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