On the Publication of a Minor Special Issue on the "Adhesive Bonding Technology"

1984 ◽  
Vol 87 (784) ◽  
pp. 229
Author(s):  
Kenichi MATSUNO
2008 ◽  
pp. 249-259 ◽  
Author(s):  
James Jian‐Qiang Lu ◽  
Tim S. Cale ◽  
Ronald J. Gutmann

2008 ◽  
Vol 53 (No. 2) ◽  
pp. 67-74 ◽  
Author(s):  
M. Müller ◽  
R. Chotěborský ◽  
J. Krmela

Adhesive bonding is one of many materials connecting methods. In the last ten years periods the bonding technology noted a boom almost in all industrial branches. The use of bonding technology in the engineering and repairing industry brings considerable savings. Saving in costs, in critical metallic materials and in time are reached and the decrease of the joint weight, too. Therefore the bonding technology pertains to the modern jointing methods even though it is a very old technique. The adhesive bonding technology is influenced by a number of factors which affect the adhesive bond strength. Correcting coefficients have to be considered in construction calculations too. The correcting coefficients correct the strength deviations caused by particular factors. In the paper there are published laboratory experiments results.


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