402 Reliability Evaluation of Thermal Stress on LSI Module Considering Variability of Heating Value Using Stochastic Finite Element Method

2010 ◽  
Vol 2010 (0) ◽  
pp. 211-212
Author(s):  
Miki YAMAZAKI ◽  
Naoto SAITO ◽  
Kenichi KASAI
2021 ◽  
Vol 184 ◽  
pp. 106099
Author(s):  
Fábio Lúcio Santos ◽  
Francisco Scinocca ◽  
Deisenara de Siqueira Marques ◽  
Nara Silveira Velloso ◽  
Flora Maria de Melo Villar

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