H122 Application of Microbubble Emission Boiling for High Heat Flux Cooling Technology

The Proceedings of the Thermal Engineering Conference ◽

10.1299/jsmeted.2013.243 ◽

2013 ◽

Vol 2013 (0) ◽

pp. 243-244 ◽

Author(s):

Koichi Suzuki ◽

Yan Chen ◽

Kazuhisa Yuki

Keyword(s):

Heat Flux ◽

High Heat ◽

High Heat Flux ◽

Cooling Technology

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Microgravity Experiments on Boiling and Applications: Research Activity of Advanced High Heat Flux Cooling Technology for Electronic Devices in Japan

Annals of the New York Academy of Sciences ◽

10.1196/annals.1324.017 ◽

2004 ◽

Vol 1027 (1) ◽

pp. 182-195 ◽

Author(s):

KOICHI SUZUKI ◽

HIROSHI KAWAMURA

Keyword(s):

Heat Flux ◽

Electronic Devices ◽

High Heat ◽

High Heat Flux ◽

Research Activity ◽

Microgravity Experiments ◽

Cooling Technology

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How is high heat flux cooling technology being driven by supercomputers

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ◽

10.1109/itherm.2004.1318359 ◽

2004 ◽

Author(s):

G. Pautsch

Keyword(s):

Heat Flux ◽

High Heat ◽

High Heat Flux ◽

Cooling Technology

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SUBCOOLED FLOW BOILING WITH MICROBUBBLE EMISSION DEVELOPMENT FOR HIGH HEAT FLUX COOLING TECHNOLOGY IN POWER ELECTRONICS

Equipment ◽

10.1615/ihtc13.p28.280 ◽

2006 ◽

Author(s):

K. Suzuki ◽

S. Tamura ◽

H. Kawamura ◽

H. Maki

Keyword(s):

Heat Flux ◽

Power Electronics ◽

Flow Boiling ◽

High Heat ◽

High Heat Flux ◽

Subcooled Flow Boiling ◽

Subcooled Flow ◽

Cooling Technology

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Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics

Transactions of The Japan Institute of Electronics Packaging ◽

10.5104/jiepeng.4.127 ◽

2011 ◽

Vol 4 (1) ◽

pp. 127-133 ◽

Author(s):

Koichi Suzuki ◽

Kazuhisa Yuki ◽

Masataka Mochizuki

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Power Electronics ◽

Boiling Heat Transfer ◽

High Heat ◽

High Heat Flux ◽

Cooling Technology

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Study of hot tungsten emissive plate in high heat flux plasma on NAGDIS-I

Journal of Nuclear Materials ◽

10.1016/s0022-3115(96)00707-6 ◽

1997 ◽

Vol 241-243 (1) ◽

pp. 1243-1247 ◽

Author(s):

M Ye

Keyword(s):

Heat Flux ◽

High Heat ◽

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Abstract of "THERMAL MANAGEMENT OF HIGH-HEAT-FLUX DEVICES EDIFICE: EMBEDDED DROPLET IMPINGEMENT FOR INTEGRATED COOLING OF ELECTRONICS"

Proceedings of the International Thermal Science Seminar Bled. Volume 2 ◽

10.1615/ichmt.2000.thersieprocvol2.100 ◽

2000 ◽

Author(s):

Cristina H. Amon

Keyword(s):

Heat Flux ◽

Thermal Management ◽

High Heat ◽

High Heat Flux ◽

Droplet Impingement ◽

Cooling Of Electronics

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HIGH HEAT FLUX BOILING AND BURNOUT AS MICROPHYSICAL PHENOMENA: MOUNTING EVIDENCE AND OPPORTUNITIES

Multiphase Science and Technology ◽

10.1615/multscientechn.v18.i3.30 ◽

2006 ◽

Vol 18 (3) ◽

pp. 251-276 ◽

Author(s):

T. G. Theofanous ◽

T. N. Dinh

Keyword(s):

Heat Flux ◽

High Heat ◽

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KEY ISSUES TO ENABLE HIGH HEAT FLUX REMOVAL EXCEEDING 10 MW/M2 BY USE OF METAL POROUS MEDIA AS A LATENT HEAT-TRANSFER DEVICE

Special Topics & Reviews in Porous Media An International Journal ◽

10.1615/specialtopicsrevporousmedia.v1.i1.10 ◽

2010 ◽

Vol 1 (1) ◽

pp. 1-13 ◽

Author(s):

Kazuhisa Yuki ◽

Hidetoshi Hashizume ◽

Saburo Toda

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Porous Media ◽

Latent Heat ◽

High Heat ◽

High Heat Flux ◽

Transfer Device

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STABLE, CALM, AND HIGH-HEAT-FLUX HEAT REMOVAL USING A POROUS-MICRO-CHANNEL

10.1615/tfec2017.prm.018154 ◽

2017 ◽

Author(s):

Tomio Okawa ◽

Junki Ohashi ◽

Ryo Hirata ◽

Koji Enoki

Keyword(s):

Heat Flux ◽

Heat Removal ◽

High Heat ◽

High Heat Flux ◽

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EFFECT OF HYDRODYNAMIC BOUNDARY LAYER STRUCTURE ON THE PERFORMANCE OF A SWIRL FLOW MICROCHANNEL HEAT SINK FOR HIGH HEAT FLUX APPLICATIONS

10.1615/tfec2017.che.018648 ◽

2017 ◽

Author(s):

Benjamin Herrmann-Priesnitz ◽

Williams Calderon-Munoz

Keyword(s):

Boundary Layer ◽

Heat Flux ◽

Heat Sink ◽

Layer Structure ◽

High Heat ◽

High Heat Flux ◽

Microchannel Heat Sink ◽

Boundary Layer Structure ◽

Hydrodynamic Boundary Layer

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