Abstract of "THERMAL MANAGEMENT OF HIGH-HEAT-FLUX DEVICES EDIFICE: EMBEDDED DROPLET IMPINGEMENT FOR INTEGRATED COOLING OF ELECTRONICS"

2000 ◽  
Author(s):  
Cristina H. Amon
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
High Heat ◽  
High Heat Flux ◽  
Droplet Impingement ◽  
Cooling Of Electronics

MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

2001 ◽  
Vol 25 (5) ◽  
pp. 231-242 ◽  
Author(s):  
Cristina H. Amon ◽  
Jayathi Murthy ◽  
S.C. Yao ◽  
Sreekant Narumanchi ◽  
Chi-Fu Wu ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
High Heat ◽  
High Heat Flux ◽  
Droplet Impingement ◽  
Cooling Of Electronics

High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift

2013 ◽  
Vol 135 (11) ◽  
Author(s):  
Heinz Herwig
Keyword(s):  
Heat Flux ◽  
Paradigm Shift ◽  
High Heat ◽  
High Heat Flux ◽  
German Research Foundation ◽  
Cooling Strategies ◽  
German Research ◽  
Definition Of ◽  
Cooling Of Electronics

In a discussion initiated by the German Research Foundation (DFG) about cooling of electronics, two aspects turned out to be important: The need for a paradigm shift from an “add on” to an “integrated multidisciplinary” solution and the definition of generic demonstrators for cooling strategies.

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

2009 ◽  
Author(s):  
Ihtesham Chowdhury ◽  
Ravi Prasher ◽  
Kelly Lofgreen ◽  
Sridhar Narasimhan ◽  
Ravi Mahajan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Flux ◽  
Thermal Management ◽  
High Performance ◽  
High Heat ◽  
Thermoelectric Device ◽  
High Heat Flux ◽  
General Will ◽  
Site Specific ◽  
Fully Integrated

We have recently reported the first ever demonstration of active cooling of hot-spots of >1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed account of both experimental and theoretical aspects of this technological demonstration and progress. We have achieved cooling of as much as 15°C at a location on the chip where the heat-flux is as high as ∼1300 W/cm2, with the help of a thin-film TEC integrated into the package. To our knowledge, this is the first demonstration of high heat-flux cooling with a thin-film thermoelectric device made from superlattices when it is fully integrated into a usable electronic package. Our results, which validate the concept of site-specific micro-scale cooling of electronics in general, will have significant potential for thermal management of future generations of microprocessors. Similar active thermal management could also be relevant for high-performance solid-state lasers and power electronic chips.

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