scholarly journals Boundary element analysis of steady-state heat conduction and thermal stresses in the LSI package.

1989 ◽  
Vol 55 (514) ◽  
pp. 1437-1444 ◽  
Author(s):  
Mitsuru SATO ◽  
Ryoji YUUKI ◽  
Sumio YOSHIOKA
Sign in / Sign up

Export Citation Format

Share Document