scholarly journals Boundary Element Analysis of Steady-State Heat Conduction and Thermal Stress in the LSI Package

Author(s):  
Mitsuru SATO ◽  
Ryoji YUUKI ◽  
Sumio YOSHIOKA
2015 ◽  
Vol 60 ◽  
pp. 137-143 ◽  
Author(s):  
Guizhong Xie ◽  
Liangwen Wang ◽  
Jianming Zhang ◽  
Dehai Zhang ◽  
Hao Li ◽  
...  

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