Adaptation Mechanism for Digital Spectrum-based Soft Failure Identification

Author(s):  
Liang Shu ◽  
Zhenming Yu ◽  
Zhiquan Wan ◽  
Kun Xu
2021 ◽  
Author(s):  
Kaixuan Sun ◽  
Zhenming Yu ◽  
Liang Shu ◽  
Zhiquan Wan ◽  
Kun Xu

Author(s):  
Liang Shu ◽  
Zhenming Yu ◽  
Zhiquan Wan ◽  
Jing Zhang ◽  
Shaohua Hu ◽  
...  

2020 ◽  
Vol 28 (9) ◽  
pp. 12529
Author(s):  
Liang Shu ◽  
Zhenming Yu ◽  
Zhiquan Wan ◽  
Kun Xu

Author(s):  
Luis Velasco ◽  
Behnam Shariati ◽  
Alba P. Vela ◽  
Jaume Comellas ◽  
Marc Ruiz

Author(s):  
Chuan Zhang ◽  
Yinzhe Ma ◽  
Gregory Dabney ◽  
Oh Chong Khiam ◽  
Esther P.Y. Chen

Abstract Soft failures are among the most challenging yield detractors. They typically show test parameter sensitive characteristics, which would pass under certain test conditions but fail under other conditions. Conductive-atomic force microscopy (CAFM) emerged as an ideal solution for soft failure analysis that can balance the time and thoroughness. By inserting CAFM into the soft failure analysis flow, success rate of such type of analysis can be significantly enhanced. In this paper, a logic chain soft failure and a SRAM local bitline soft failure are used as examples to illustrate how this failure analysis methodology provides a powerful and efficient solution for soft failure analysis.


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