Characterization of optical PCB interconnects by means of low-coherence interferometry

Author(s):  
S. Fabiani ◽  
M. Farina ◽  
A. Di Donato ◽  
A. Lucesoli ◽  
L. Criante ◽  
...  
1993 ◽  
Author(s):  
Joseph M. Schmitt ◽  
Alexander R. Knuettel ◽  
Amir H. Gandjbakhche ◽  
Robert F. Bonner

2009 ◽  
Vol 34 (7) ◽  
pp. 1123 ◽  
Author(s):  
Purnananda Nandi ◽  
Zilun Chen ◽  
Agata Witkowska ◽  
William J. Wadsworth ◽  
Timothy A. Birks ◽  
...  

2017 ◽  
Vol 25 (4) ◽  
pp. 3222 ◽  
Author(s):  
Ó. Martínez-Matos ◽  
C. Rickenstorff ◽  
S. Zamora ◽  
J.G. Izquierdo ◽  
P. Vaveliuk

2004 ◽  
Vol 829 ◽  
Author(s):  
Wojciech J. Walecki ◽  
Vitali Souchkov ◽  
Kevin Lai ◽  
Phuc Van ◽  
Manuel Santos ◽  
...  

ABSTRACTSingle probe infrared low coherence optical interferometry has been proven to be an effective tool for characterization of thin and ultra-thin semiconductor Si and compound materials wafers. Its application was however limited to wafers transparent at probing wavelength, and having relatively smooth surfaces. Purpose of this paper is to present an extension of low coherence interferometry to characterization of non-transparent wafers, and wafers with rough surfaces.


2020 ◽  
Vol 59 (01) ◽  
pp. 1
Author(s):  
Nélida A. Russo ◽  
Eneas N. Morel ◽  
Jorge R. Torga ◽  
Ricardo Duchowicz

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