Water-based hybrid nanosuspensions for abrasive machining of brittle solids

2021 ◽  
Author(s):  
◽  
Shuiquan Huang
2010 ◽  
Vol 447-448 ◽  
pp. 183-187 ◽  
Author(s):  
Zhen Yu Zhang ◽  
Rudy Irwan ◽  
Han Huang

Surface characteristics of CZT wafers machined using wire sawing, free abrasives lapping and polishing and ultra-precision grinding were investigated. Wire sawing resulted in the removal of material in both ductile and brittle regimes, but both polishing and grinding led to a ductile removal. The grinding produced very smooth surfaces free of embeddings and scratches, which is thus considered to have better machinability than the free abrasive machining. The nanoindentation and nanoscratch on MCT wafers at nanometric scales resulted in considerable plastic deformation, but no fracture features. The hardness of the MCT wafer was 500 to 550 MPa, and the coefficient of friction was particularly high, ranging from 0.45 to 0.55.


2008 ◽  
Vol 389-390 ◽  
pp. 308-313 ◽  
Author(s):  
Peter Hug ◽  
Andrew R. Nelson ◽  
Stuart C. Salmon

There are few water-based fluids, on the market, designed specifically for grinding and abrasive machining processes. Fluid manufacturers, caught up in serving the “non-cutting” functions, have neglected the prime reasons for using a grinding fluid. This paper begins to assess water-based fluid chemistries and observe the cause and effect relationship with respect to grinding power and wheel life. The end result will be not only be a next generation grinding fluid, but also a better understanding of the role of the grinding fluid in a grinding or abrasive machining operation.


2000 ◽  
Vol 10 (PR9) ◽  
pp. Pr9-281-Pr9-286 ◽  
Author(s):  
N. K. Bourne ◽  
J. C.F. Millett
Keyword(s):  

Author(s):  
N.P. Kopylov ◽  
◽  
D.V. Fedotkin ◽  
A.V. Karpov ◽  
E.Yu. Sushkina ◽  
...  
Keyword(s):  

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