scholarly journals An ultra-wide band printed small aperture tapered slot phased array antenna covering 6-18GHZ

2018 ◽  
Vol 7 (4) ◽  
pp. 2628
Author(s):  
G. NagaPavani ◽  
Ch. Lakshmi Prasanna ◽  
Dr. N.N. Sastry

For phased array applications covering ultra wide bandwidth, it is necessary to restrict the size of the aperture to less than λ/2 at highest frequency of operation. For 6-18 GHz coverage, an aperture size of less than 9.76mm is required for scanning to ±450 without appearance of grating lobes and occurrence of element pattern nulls over the band. Meeting this requirement a printed tapered slot antenna has been designed with the above aperture size. Detailed parametric studies have been carried out over 6-18 GHz and dimensions have been opti-mized for return loss. The design has been carried out with HFSS software. A return loss of less than -7.5dB across 5.6 - 20 GHz has been obtained for a single antenna. Also satisfactory radiation patterns have been obtained. 

This article deals with the various designs of a novel compact microstrip fed UWB antenna to investigate the corresponding return losses of different structures. The dimension of the designed antenna is 33 x 19 x 1.9 mm3 with FR4 substrate and it can be operated from 2.846 - 11.7458 GHz. The effects of varying the structure of antenna are to exhibit the investigation of corresponding return losses. Different structures of antenna are simulated in Ansoft HFSS simulator. The results of return losses and radiation patterns are explored with the ultra wide band (UWB) rectangular Stair slot antenna. The modified structure of antenna shows the minimized return loss with an enhanced bandwidth that satisfies good UWB characteristics. Antenna performance can also be explored from the radiation behavior of the antenna which is relatively omni-directional pattern for rectangular Stair slot antenna


1972 ◽  
Vol 20 (6) ◽  
pp. 699-704 ◽  
Author(s):  
G. Laughlin ◽  
E. Byron ◽  
T. Cheston

Frequenz ◽  
2012 ◽  
Vol 66 (7-8) ◽  
Author(s):  
Jun Zhou ◽  
Wei Shi ◽  
Wen-Bin Dou ◽  
Ya Shen

AbstractA kind of three dimensional Low Temperature Co-fired Ceramic (LTCC)-System in Package (SIP) transition was proposed in this paper. The basic design of SIP with LTCC technology was done by vertical transitions which transmit the microwave signal from the bottom to the surface of the substrate. The measured insertion loss did not exceed 1.5 dB, which contains the insertion loss of the test board about 0.6 dB at 18 GHz and the return loss was better than


Sign in / Sign up

Export Citation Format

Share Document