Aufbau und Charakterisierung eines kalorimetrischen Strömungssensors in Dickschichttechnik (Development and Characterization of a Calorimetric Flow Sensor Realized in Thick-Film Technology)

2006 ◽  
Vol 73 (10) ◽  
Author(s):  
Walter Smetana ◽  
Michael Unger ◽  
Walter Gschohsmann
Keyword(s):  
Thick Film ◽  
Flow Sensor ◽  
Thick Film Technology

Characterization of Thick Film Technology for 300°C Packaging

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000097-000107 ◽  
Author(s):  
Rui Zhang ◽  
R. Wayne Johnson ◽  
Vinayak Tilak ◽  
Tan Zhang ◽  
David Shaddock
Keyword(s):  
Thick Film ◽  
Analog Circuits ◽  
Passive Components ◽  
Term Operation ◽  
C Storage ◽  
Selection Of ◽  
Device Technology ◽  
Thick Film Technology

Geothermal well logging and instrumentation applications require electronics capable of 300°C operation. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. However, to build functional circuits, an interconnection and packaging technology must be demonstrated to provide interconnectivity between different SiC devices and passive components. For long-term operation, organic based packaging is limited to ∼250°C with careful selection of materials. Thick film technology based on ceramics and metals has potential for higher operating temperatures. In this work the effect of 300°C storage on the adhesion of different thick film Au conductors and a multilayer dielectric have been studied. In addition, the electrical properties of the dielectric have been studied as a function of temperature and of high temperature aging. Assembly technologies: component attach, wire bonding and external lead attach have also been investigated and the results are reported.

Characterization of LTCC-Thick Film Technology for 300°C Packaging

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000046-000051 ◽  
Author(s):  
Tan Zhang ◽  
David Shaddock ◽  
Alexey Vert ◽  
Rui Zhang ◽  
R. Wayne Johnson
Keyword(s):  
Thick Film ◽  
Reservoir Characterization ◽  
Temperature Cycling ◽  
Potential Candidate ◽  
Term Operation ◽  
Die Attach ◽  
Functional Analog ◽  
Thick Film Technology

Economic geothermal well construction and reservoir characterization requires high temperature logging tools and sensors with the long-term operation capability of 300°C. Low temperature co-fired ceramic (LTCC) and thick film technology make them a potential candidate for building interconnects to SiC device and functional analog or digital circuits to operate at that temperature. In this work, single conductor layer LTCC substrates have been fabricated to characterize the thick film Au adhesion under 300°C aging. Via reliability has been evaluated on the multi-layer LTCC substrates under temperature cycling of 35–325°C. In addition, die attach, wire bonding and stud bumping assembly techniques has been investigated.

Handbook of Thick Film Technology

1976 ◽  
Vol 22 (11-12) ◽  
pp. 791
Author(s):  
R. Naylor
Keyword(s):  
Thick Film ◽  
Thick Film Technology

Characterization of a LiCoO2 thick film by screen-printing for a lithium ion micro-battery

2006 ◽  
Vol 159 (2) ◽  
pp. 1416-1421 ◽  
Author(s):  
Moon Soo Park ◽  
Sang Hoon Hyun ◽  
Sang Cheol Nam
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Lithium Ion

Sensor applications of thick-film technology

1988 ◽  
Vol 135 (4) ◽  
pp. 77 ◽  
Author(s):  
J.E. Brignell ◽  
N.M. White ◽  
A.W.J. Cranny
Keyword(s):  
Thick Film ◽  
Sensor Applications ◽  
Thick Film Technology
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