Aufbau und Charakterisierung eines kalorimetrischen Strömungssensors in Dickschichttechnik (Development and Characterization of a Calorimetric Flow Sensor Realized in Thick-Film Technology)

Walter Smetana; Michael Unger; Walter Gschohsmann

doi:10.1524/teme.2006.73.10.566

Aufbau und Charakterisierung eines kalorimetrischen Strömungssensors in Dickschichttechnik (Development and Characterization of a Calorimetric Flow Sensor Realized in Thick-Film Technology)

tm - Technisches Messen ◽

10.1524/teme.2006.73.10.566 ◽

2006 ◽

Vol 73 (10) ◽

Author(s):

Walter Smetana ◽

Michael Unger ◽

Walter Gschohsmann

Keyword(s):

Thick Film ◽

Flow Sensor ◽

Thick Film Technology

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Aspects concerning the optimization of a calorimetric flow sensor built up in thick-film technology

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. ◽

10.1109/isse.2005.1491059 ◽

2005 ◽

Cited By ~ 3

Author(s):

D. Guleryuz ◽

W. Smetana ◽

H. Homolka ◽

M. Mundlein ◽

M. Unger

Keyword(s):

Thick Film ◽

Flow Sensor ◽

Thick Film Technology

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Characterization of Thick Film Technology for 300°C Packaging

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hitec-rwjohnson-tp12 ◽

2010 ◽

Vol 2010 (HITEC) ◽

pp. 000097-000107 ◽

Cited By ~ 1

Author(s):

Rui Zhang ◽

R. Wayne Johnson ◽

Vinayak Tilak ◽

Tan Zhang ◽

David Shaddock

Keyword(s):

Thick Film ◽

Analog Circuits ◽

Passive Components ◽

Term Operation ◽

C Storage ◽

Selection Of ◽

Device Technology ◽

Thick Film Technology

Geothermal well logging and instrumentation applications require electronics capable of 300°C operation. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. However, to build functional circuits, an interconnection and packaging technology must be demonstrated to provide interconnectivity between different SiC devices and passive components. For long-term operation, organic based packaging is limited to ∼250°C with careful selection of materials. Thick film technology based on ceramics and metals has potential for higher operating temperatures. In this work the effect of 300°C storage on the adhesion of different thick film Au conductors and a multilayer dielectric have been studied. In addition, the electrical properties of the dielectric have been studied as a function of temperature and of high temperature aging. Assembly technologies: component attach, wire bonding and external lead attach have also been investigated and the results are reported.

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Characterization of LTCC-Thick Film Technology for 300°C Packaging

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hiten-paper2-tzhang ◽

2011 ◽

Vol 2011 (HITEN) ◽

pp. 000046-000051 ◽

Cited By ~ 4

Author(s):

Tan Zhang ◽

David Shaddock ◽

Alexey Vert ◽

Rui Zhang ◽

R. Wayne Johnson

Keyword(s):

Thick Film ◽

Reservoir Characterization ◽

Temperature Cycling ◽

Potential Candidate ◽

Term Operation ◽

Die Attach ◽

Functional Analog ◽

Thick Film Technology

Economic geothermal well construction and reservoir characterization requires high temperature logging tools and sensors with the long-term operation capability of 300°C. Low temperature co-fired ceramic (LTCC) and thick film technology make them a potential candidate for building interconnects to SiC device and functional analog or digital circuits to operate at that temperature. In this work, single conductor layer LTCC substrates have been fabricated to characterize the thick film Au adhesion under 300°C aging. Via reliability has been evaluated on the multi-layer LTCC substrates under temperature cycling of 35–325°C. In addition, die attach, wire bonding and stud bumping assembly techniques has been investigated.

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