Measuring Diffusion Lengths in Epitaxial Silicon by Surface Photovoltage

1995 ◽  
Vol 386 ◽  
Author(s):  
John Lowell ◽  
Valerie Wenner ◽  
Damon Debusk

ABSTRACTIn CMOS, the use of epitaxial layers for prevention of latch-up in logic technologies is well-known and pervasive. One of the crucial parameters is the amount of metallic contamination due to transition metals such as Fe in the epi since this phenomena effects both device performance and quality. However, the ability to measure this parameter on product material is not generally available due to inherent problems with most known methods. The limitation of traditional surface photovoltage is that the deep optical penetration of over a hundred microns is well-beyond the depth of most epitaxial layers and does not accurately profile the epitaxial region [1]. In this paper we report on the application of optical surface photovoltage (SPV) using a set of ultra-shallow optical filters to both quantify and qualify as-grown epitaxial layers on CZ P-type silicon. We believe that a non-contact, SPV measurement of Fe concentration and diffusion lengths within an epitaxial region has not been previously reported.

1988 ◽  
Vol 49 (C4) ◽  
pp. C4-165-C4-168
Author(s):  
J. P. NOUGIER ◽  
A. MOATADID ◽  
J. C. VAISSIERE
Keyword(s):  
P Type ◽  

1984 ◽  
Vol 36 ◽  
Author(s):  
S. P. Tobin ◽  
A. C. Greenwald ◽  
R. G. Wolfson ◽  
D. L. Meier ◽  
P. J. Drevinsky

ABSTRACTMolybdenum contamination has been detected in silicon epitaxial layers and substrate wafers after processing in any one of several epitaxial silicon reactors. Greatly reduced minority carrier diffusion lengths and lifetimes are consistent with Mo concentrations measured by DLTS in the 1012 and 1013 cm−3 ranges. Depth profiling of diffusion length and the Mo deep level show much greater penetration than expected from previous reports of Mo as a slow diffuser. The data indicate a lower limit of 10−8 cm2/sec for the diffusion coefficient of Mo in silicon at 1200°C, consistent with high diffusivities measured for other transition metals.


1996 ◽  
Vol 428 ◽  
Author(s):  
Julia Sherry ◽  
John Lowell ◽  
Tim Hossain ◽  
Damon Debusk

AbstractIn CMOS, the addition of chlorine particularly in TCA form to the growth of thermal oxides in logic technologies is well-known and pervasive. In addition to the increasing environmental concerns of chlorine use, one of the important parameters is the amount of metallic contamination due to transition metals such as Fe in the Si, and alkali metals like Na in the oxide since these phenomena effect both device performance and quality. However, the ability to measure this parameter on product material is not generally available due to inherent problems with most known methods. In this paper we report on the application of high-injection, frequency based optical surface photovoltage (SPV) and a more recent technique known as a contact potential difference (CPD) to both quantify and qualify as-grown oxides on CZ P-type silicon.


1995 ◽  
Vol 378 ◽  
Author(s):  
Ronald E. Bell ◽  
Serguei Ostapenko ◽  
Jacek Lagowski

AbstractExperimental evidence is provided for ultrasound stimulated dissociation of metal-acceptor pairs in silicon, and also for enhanced diffusion of metal interstitials which may lead to enhanced pairing. The first effect is found dominant in Fe-doped p-type silicon where ultrasound causes low temperature dissociation of Fe-B pairs. This is in contrast to Cr-doped p-type silicon where ultrasound enhances the formation of Cr-B pairs due to enhanced diffusivity of Cr by as much as two orders of magnitude.In this study, the metal-acceptor reaction was monitored in situ via corresponding changes of the minority carrier diffusion length measured by non-contact surface photovoltage. Ultrasound-stimulated pair reaction can be utilized for metal diagnostics for the silicon IC industry. Thus, with ultrasound, Cr-B pairing can be reduced from months to hours, making possible the identification of Cr via pairing kinetics in a reasonable period of time.


1998 ◽  
Vol 72 (18) ◽  
pp. 2298-2300 ◽  
Author(s):  
Deepak A. Ramappa ◽  
Worth B. Henley

AIP Advances ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 085005
Author(s):  
Kevin Lauer ◽  
Geert Brokmann ◽  
Mario Bähr ◽  
Thomas Ortlepp
Keyword(s):  

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