Thermomechanical Stresses in Copper Interconnect/Low-κ Dielectric Systems
Keyword(s):
AbstractNumerical simulations of thermal stresses in copper interconnect and low-κ dielectric systems are carried out. The analyses include two- and three-dimensional finite element modeling of the interconnect structure. Various combinations of metal, oxide and polymer-based low-κ dielectric schemes are considered in the simulation. The evolution of stresses and deformation pattern in copper, barrier layers, and the dielectrics are critically assessed.
1995 ◽
Vol 43
(6)
◽
pp. 2417-2428
◽
2012 ◽
Vol 38
(6)
◽
pp. 332
◽