Detailed Sampling and Quality Control Procedures for the Calgon Water Treatment Facility at Rocky Mountain Arsenal,

1978 ◽  
Author(s):  
D. Prusinski
1986 ◽  
Author(s):  
Jack C. Pantleo ◽  
II Clark ◽  
Reynolds James A. ◽  
Dianna L.

2013 ◽  
Vol 3 (2) ◽  
pp. 252-261 ◽  
Author(s):  
Justine Rayner ◽  
Brian Skinner ◽  
Daniele Lantagne

Locally produced ceramic pot filters have been shown to improve the microbiological quality of household drinking water and reduce the burden of diarrheal disease in users. They are considered one of the most promising household water treatment methods. However, overarching manufacturing and quality control guidelines do not exist for the 35 decentralized filter factories in 18 countries that currently produce filters. In this study, we conducted manufacturing process surveys with 25 filter factories worldwide to document production methods and identify areas where manufacturing and quality control guidelines are needed. Our results show that manufacturing processes vary widely both between and within factories, including the consistency of materials, manufacturing methods, and quality control practices. These variations pose concerns about the consistency and quality of locally produced filters in the absence of standardized quality control procedures. We propose areas where manufacturing guidelines are needed to assist factories in producing consistently high quality filters, and identify topics where further research is needed to refine manufacturing recommendations. These results guided the development of a best practice manual that described consensus-based recommendations to advance consistent, quality-controlled filter production world-wide.


Author(s):  
Hua Younan

Abstract In wafer fabrication (Fab), Fluorine (F) based gases are used for Al bondpad opening process. Thus, even on a regular Al bondpad, there exists a low level of F contamination. However, the F level has to be controlled at a lower level. If the F level is higher than the control/spec limits, it could cause F-induced corrosion and Al-F defects, resulting in pad discoloration and NSOP problems. In our previous studies [1-5], the theories, characteristics, chemical and physical failure mechanisms and the root causes of the F-induced corrosion and Al-F defects on Al bondpads have been studied. In this paper, we further study F-induced corrosion and propose to establish an Auger monitoring system so as to monitor the F contamination level on Al bondpads in wafer fabrication. Auger monitoring frequency, sample preparation, wafer life, Auger analysis points, control/spec limits and OOC/OOS quality control procedures are also discussed.


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