Ion thruster thermal characteristics and performance

1972 ◽  
Author(s):  
L. WEN ◽  
E. PAWLIK ◽  
J. CROTTY
1973 ◽  
Vol 10 (1) ◽  
pp. 35-41 ◽  
Author(s):  
L. WEN ◽  
J. D. CROTTY ◽  
E. V. PAWLIK

2017 ◽  
Vol 132 ◽  
pp. 454-459 ◽  
Author(s):  
Clifford A Elwell ◽  
Harper Robertson ◽  
Jez Wingfield ◽  
Phillip Biddulph ◽  
Virginia Gori

Pulsating heat pipes are complex devices for heat transfer and their optimal thermal performance depends mainly on different parameters. This work is about the thermal efficiency of a closed-loop oscillating heat pipe with a diameter of 2.0 mm and 3.0 copper tube inner and outer. For all experiments, the filling ratio (FR) was used 40%, 50 %,70%,80% and heat inputs of 20W, 40W, 60W, and 80W was provided to PHP. The position of the PHP was vertical bottom heat type. The length of evaporator, adiabatic and condenser section was maintained 52 mm,170mm,60mm. Water and benzene were selected as working fluids. From the available literature it is observed that working fluid and filling ratio are key factors in PHP's performance. The results show that the thermal resistance decreases rapidly with the increase in the heat input to 20 to 40 W., while it decreases gradually over 40 to 80W.Simulation is done in CFD and experimental data were equated to the results.


1987 ◽  
Vol 11 (3) ◽  
pp. 343-357 ◽  
Author(s):  
R. S. Beniwal ◽  
Ramvir Singh ◽  
P. V. Bakore

1999 ◽  
Author(s):  
Helmut Bassner ◽  
Robert Bond ◽  
Vaughan Thompson ◽  
Hans-Peter Harmann ◽  
K. Groh

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2218
Author(s):  
Nabi S. Shabanov ◽  
Kamil Sh. Rabadanov ◽  
Sagim I. Suleymanov ◽  
Akhmed M. Amirov ◽  
Abdulgalim B. Isaev ◽  
...  

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.


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