scholarly journals Identifikasi Pemborosan Aktivitas di Lantai Produksi PSR Menggunakan Process Activity Mapping dan Waste Assessment Model

2021 ◽  
Vol 7 (2) ◽  
pp. 95-102
Author(s):  
Yulinda Uswatun Kasanah ◽  
Pratya Poeri Suryadhini
Keyword(s):  
Root Cause Analysis ◽  
Assessment Model ◽  
Cause Analysis ◽  
Root Cause

Salah satu produsen ban terbesar di Indonesia dalam proses produksinya memiliki beberapa family produk seperti Passenger Tires, Commercial Tires, dan Industrial Tires. Passenger Tires atau PSR merupakan family produk dengan penjualan terbesar, akan tetapi dalam perkembangannya terdeteksi adanya penurunan performa produksi yang mempengaruhi optimalisasi penjualan perusahaan. Berdasarkan studi pendahuluan teridentifikasi adanya beberapa aktivitas pemborosan di lini produksi ban PSR. Mapping aktivitas bertujuan untuk menemukan jenis waste yang tepat pada setiap departemen produksi maupun workstation. Mapping dilakukan dengan menggunakan diagram Swimlane dan Process Activity Mapping (PAM). Hasil mapping mengidentifikasi aktivitas yang tidak memberikan nilai tambah dengan persentase aktivitas sebesar 48%. Waste assessment model (WAM) dipakai untuk menentukan peringkat seven waste. Dari hasil analisis dengan menggunakan metode WAM diperoleh tiga waste kritis utama yaitu waiting, motion, dan overproduction dengan proporsi masing-masing waste sebesar 22%, 18%, dan 16%. Setelah diketahui waste kritis maka dilakukan analisis akar masalah penyebab waste dengan menggunakan fishbone chart diagram dan root cause analysis.

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

Root Cause Analysis for the ATIRCM/CMWS Program

2010 ◽  
Author(s):  
Harold S. Balaban ◽  
Paul M. Kodzwa ◽  
Andrew S. Rehwinkel ◽  
Gregory A. Davis ◽  
Patricia F. Bronson
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause
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