ADAPTATION OF THE METHOD OF CONTROLLING CUTTING MODES TO INDUSTRIAL CONDITIONS

IZVESTIA VOLGOGRAD STATE TECHNICAL UNIVERSITY ◽

10.35211/1990-5297-2021-1-248-38-41 ◽

2021 ◽

pp. 38-41

Author(s):

E. M. Frolov ◽

A. V. Rogachev ◽

V. G. Fadeev ◽

S. S. Semenyaka

Keyword(s):

Tool Material ◽

Contact Pair ◽

Automatic Determination ◽

Material Contact ◽

Thermal Emf ◽

Cutting Modes

Variants of devices with the possibility of using the test pass method in industrial conditions for automatic determination of cutting modes by measuring the mutual properties of the tool - material contact pair through the value of the thermal EMF that occurs during machining are considered.

Download Full-text

197 An algorithm for automatic determination of pre-ventricular atrial blanking

EP Europace ◽

10.1016/s1099-5129(05)80110-2 ◽

2005 ◽

Vol 7 ◽

pp. 37-38

Keyword(s):

Automatic Determination

Download Full-text

On Automatic Determination of Movement Phases in Manual Transport During the Precision Grip

Critical Reviews in Biomedical Engineering ◽

10.1615/critrevbiomedeng.v28.i12.410 ◽

2000 ◽

Vol 28 (1-2) ◽

pp. 237-245 ◽

Cited By ~ 4

Author(s):

Nasser Hosseini ◽

Blanka Hejdukova ◽

Pall E. Ingvarsson ◽

Bo Johnels ◽

Torsten Olsson

Keyword(s):

Precision Grip ◽

Automatic Determination

Download Full-text

Automatic Determination of Optimal FIB Operations for Improved Circuit Probing and Fast Reconfiguration

ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2000p0407 ◽

2000 ◽

Author(s):

Romain Desplats ◽

Timothee Dargnies ◽

Jean-Christophe Courrege ◽

Philippe Perdu ◽

Jean-Louis Noullet

Keyword(s):

Integrated Circuit ◽

Focused Ion Beam ◽

Ion Beam ◽

Semiconductor Devices ◽

Front Side ◽

Automatic Determination ◽

Metal Line ◽

New Approach ◽

Metal Layers

Abstract Focused Ion Beam (FIB) tools are widely used for Integrated Circuit (IC) debug and repair. With the increasing density of recent semiconductor devices, FIB operations are increasingly challenged, requiring access through 4 or more metal layers to reach a metal line of interest. In some cases, accessibility from the front side, through these metal layers, is so limited that backside FIB operations appear to be the most appropriate approach. The questions to be resolved before starting frontside or backside FIB operations on a device are: 1. Is it do-able, are the metal lines accessible? 2. What is the optimal positioning (e.g. accessing a metal 2 line is much faster and easier than digging down to a metal 6 line)? (for the backside) 3. What risk, time and cost are involved in FIB operations? In this paper, we will present a new approach, which allows the FIB user or designer to calculate the optimal FIB operation for debug and IC repair. It automatically selects the fastest and easiest milling and deposition FIB operations.

Download Full-text